Product description
The Qualcomm PMI-632-9-WLNSP81B-HR-02-3-00 is engineered to meet the rigorous power management demands of modern electronic devices. Its architecture is tailored for mobile applications, where efficiency, compactness, and reliability are critical.
The PMIC features advanced control mechanisms that allow for dynamic voltage scaling, which adjusts the output voltage based on the load requirements. This capability not only enhances efficiency but also reduces heat generation, which is vital for maintaining the performance of mobile devices.
In addition to its power management capabilities, the PMI-632-9-WLNSP81B-HR-02-3-00 includes various protection features such as over-voltage protection (OVP), under-voltage lockout (UVLO), and thermal shutdown. These features ensure the safety and longevity of both the PMIC and the devices it powers.
The integration of multiple output channels allows the device to power various components simultaneously, making it ideal for complex systems that require multiple voltage rails. The PMIC's ability to manage power paths intelligently ensures seamless transitions between different power sources, such as battery and external power, without interrupting device operation.
Furthermore, the compact QFN package design allows for efficient use of PCB space, making it an attractive option for manufacturers looking to optimize their designs. The device's thermal performance is also enhanced by its design, allowing for effective heat dissipation even under heavy load conditions.
In summary, the Qualcomm PMI-632-9-WLNSP81B-HR-02-3-00 is a versatile and efficient power management solution that meets the needs of modern mobile and wireless applications, combining high performance, compact design, and robust protection features.
Specification parameters
Input Voltage Range: Typically operates within a range of 3.0V to 5.5V, accommodating various battery types.
Output Voltage Range: Adjustable output voltages, typically ranging from 0.8V to 3.3V, depending on application requirements.
Output Current: Capable of delivering up to 3A per channel, suitable for high-performance applications.
Switching Frequency: Operates at a switching frequency of up to 2MHz, allowing for smaller external components and improved efficiency.
Package Type: Available in a compact QFN (Quad Flat No-lead) package, enhancing thermal performance and reducing PCB space.
Operating Temperature Range: Designed to function effectively in a wide temperature range, typically from -40°C to +85°C, ensuring reliability in various environments.
