Wireless Network Chip

QCA-6391-0-NSP265-TR-02-0

  • Dual-Band Wi-Fi Connectivity: It supports both 2.4GHz and 5GHz bands, allowing for versatile connectivity options that enhance performance in diverse environments.
  • Bluetooth Integration: With Bluetooth 5.0 capabilities, the chip enables improved range, speed, and energy efficiency, making it ideal for connected devices.

Product Description

The Qualcomm QCA-6391-0-NSP265-TR-02-0 is engineered to provide reliable and efficient wireless connectivity for a broad range of applications. Its dual-band Wi-Fi functionality facilitates optimal performance by balancing network load and reducing interference, which is critical for applications requiring stable connections, such as video streaming or online gaming.

Moreover, the integration of Bluetooth 5.0 enhances the chip's capability to connect multiple devices seamlessly, while its low power design ensures minimal energy consumption, making it an excellent choice for IoT devices that rely on battery power.

The chip's advanced security features safeguard user data and maintain privacy, making it suitable for applications in smart homes and sensitive environments. With its robust specifications and features, the QCA-6391-0 is positioned as a leading solution for manufacturers looking to incorporate advanced connectivity into their products.

Overall, the Qualcomm QCA-6391-0-NSP265-TR-02-0 is a highly capable chip that meets the ultimate requirements of today’s wireless communication landscape, providing both performance and security.


Specification

  • Wi-Fi Standards: Supports 802.11ac and 802.11n, enabling high-speed wireless connections.

  • Maximum Data Rates: Achieves up to 867 Mbps on the 5GHz band and 300 Mbps on the 2.4GHz band, allowing for seamless streaming and data transfer.

  • MIMO Technology: Features 2x2 MIMO (Multiple Input Multiple Output), enhancing throughput and providing stable connections even in crowded environments.

  • Interface Support: The chip supports various interfaces, including PCIe and USB, enabling flexible integration with different system architectures.

  • Operating Temperature Range: It operates effectively in a wide temperature range, making it suitable for various environmental conditions.


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