Bluetooth Audio SoC

QCC-1110-0-111NSP-TR-00-0

  • The QCC-1110 is designed to operate with extremely low power, making it ideal for always-on voice assistants, wearable devices, and IoT applications. Its ultra-efficient architecture allows for prolonged operation on small batteries, enabling compact devices to maintain functionality for extended periods.One of the standout features of the QCC-1110 is its dedicated voice activation and processing capability. It is designed to listen for wake words continuously, enabling hands-free voice command systems while minimizing power usage. This makes it ideal for smart home devices, voice-activated earbuds, and voice-assistant products.The 111-NSP package provides a highly compact solution that is easy to integrate into small form factor devices such as smartwatches, earbuds, and other wearables. Its small footprint helps manufacturers design ultra-compact devices with powerful voice processing and low power requirements.

产品描述

The Qualcomm QCC-1110-0-111NSP-TR-00-0 is a specialized ultra-low-power SoC (System on Chip) developed for always-on voice processing and command recognition in wearable devices, smart home products, and other IoT (Internet of Things) applications. The QCC-1110 is tailored for devices that require minimal power usage while providing advanced voice detection and processing capabilities, such as voice-activated assistants, voice command systems, and smart earbud products.

The key feature of the QCC-1110 is its ability to continuously listen for wake words like "Hey Siri" or "OK Google" while consuming minimal energy. This makes it an excellent choice for always-on voice assistant products, where energy efficiency is paramount. By using an ARM Cortex-M0 processor optimized for low-power operation, the QCC-1110 ensures that devices can remain operational for extended periods on small batteries, making it perfect for compact applications like wearables, smartwatches, earbuds, and smart speakers.

The integrated audio DSP (Digital Signal Processor) enables sophisticated audio processing, including noise suppression and echo cancellation, ensuring that voice commands are recognized clearly even in challenging environments with background noise.

The QCC-1110’s compact size, offered by its 111-NSP package, ensures easy integration into small devices, making it ideal for wearable technologies and smart home applications. Despite its small size, the chip provides essential interfaces such as I²S, I²C, and UART, which allow it to communicate with external sensors, audio components, or additional processors.

规格参数

  • Memory:

    • RAM: 32 KB

    • ROM: 32 KB

    • Supports external flash memory for firmware updates or additional feature storage.


  • Power Consumption:

    • Standby Power: Ultra-low standby power consumption, designed to maximize battery life in always-on applications.

    • Active Mode: Optimized for minimal power use during active listening and processing.


  • Package Type:

    • 111-NSP (Non-Solder Pad) package, which is a compact design ideal for space-constrained applications like wearables, voice-activated earbuds, and IoT devices.

    • Small package size ensures efficient integration into even the smallest devices.


  • Bluetooth Support:

    • Although not a dedicated Bluetooth chip, the QCC-1110 can be paired with Bluetooth solutions for voice-controlled Bluetooth devices. It can work alongside Bluetooth chips to enable voice functionality in wireless audio products and smart home systems.


  • Connectivity and Interfaces:

    • I²S (Inter-IC Sound): Supports digital audio transmission between the QCC-1110 and external audio components like microphones or speakers.

    • I²C and SPI Interfaces: Available for communication with other system components such as sensors or additional processors.

    • UART (Universal Asynchronous Receiver-Transmitter): For communication with other microcontrollers or processors.


  • Operating Voltage:

    • Operates at 1.8V to 3.3V, making it suitable for low-power devices such as earbuds, wearables, and smart home products.


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