Bluetooth Audio SoC

QCC-3001-2-68CSP-MT-00-0

  • The Qualcomm QCC-3001 is engineered to minimize power usage, making it suitable for devices like wireless earbuds or low-cost Bluetooth speakers that require long battery life. It supports various low-power states, including sleep modes, to conserve energy during periods of inactivity.This SoC (System on Chip) is fully compatible with Bluetooth 4.2, providing efficient wireless communication while maintaining solid performance for typical Bluetooth audio streaming applications. The QCC-3001 integrates a DSP for enhancing audio processing. It supports key features like noise suppression, echo cancellation, and equalization to improve sound quality.

产品描述

The Qualcomm QCC-3001-2-68CSP-MT-00-0 is part of Qualcomm's line of Bluetooth audio SoCs, designed specifically for entry-level wireless audio devices. Its primary focus is on providing an affordable yet capable solution for manufacturers developing Bluetooth-enabled products like wireless earphones, budget Bluetooth speakers, and simple headset designs.

This chip supports Bluetooth 4.2, offering stable and secure wireless connections for users without the need for the higher performance (and cost) associated with Bluetooth 5.0. With a focus on low power consumption, the QCC-3001 ensures that devices using this chip can provide long battery life, a critical factor in portable audio devices such as earbuds. Power management is enhanced with low-energy modes, allowing the device to conserve battery when not actively streaming audio.

The integrated DSP plays a vital role in improving the quality of sound, particularly for lower-cost devices. By including features like echo cancellation and noise suppression, the chip allows audio products to deliver better sound without requiring expensive hardware. 

In terms of form factor, the 68-CSP package is compact but slightly larger than more advanced chips like the QCC-3002. This size is still appropriate for use in portable devices, making the QCC-3001 an excellent choice for manufacturers looking to keep costs down without sacrificing core functionality.

规格参数

  • Bluetooth Version:

    • Bluetooth 5.0 compliant, supporting Bluetooth Low Energy (BLE) and standard Bluetooth communication for wireless audio and data transfer.


  • Audio DSP:

    • Integrated DSP core capable of processing advanced audio features like noise suppression, voice processing, and audio codec management.

    • Supports Qualcomm’s aptX codec for superior wireless audio transmission, ensuring low-latency audio playback.


  • Supported Profiles:

    • A2DP (Advanced Audio Distribution Profile)

    • HFP (Hands-Free Profile)

    • HSP (Headset Profile)

    • AVRCP (Audio/Video Remote Control Profile)

    • GATT (Generic Attribute Profile for BLE communication)


  • Operating Voltage:

    • 1.8V to 3.6V, making it compatible with a wide range of power sources, including compact rechargeable batteries found in wireless audio devices.


  • Memory:

    • 64 KB of RAM and 32 KB of ROM for basic Bluetooth stack and firmware operations.

    • Supports external flash memory for firmware and system updates, enhancing product versatility.


  • Power Consumption:

    • Optimized for minimal power usage in active, idle, and deep sleep modes to conserve battery life, especially in wireless earbuds and wearables.


  • Package Type:

    • 68-CSP (Chip Scale Package), enabling a small form factor for space-limited applications. This package helps manufacturers design extremely compact products without compromising on performance.


  • Codec Support:

  • SBC (Subband Coding)

  • AAC (Advanced Audio Coding)

  • aptX and aptX Low Latency for high-quality, low-latency wireless audio streaming.


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