Bluetooth Audio SoC

QCC-3002-2-68CSP-TR-00-0

  • The Qualcomm QCC-3002 is a Bluetooth audio chip designed for low-cost, low-power wireless audio solutions, offering reliable performance for entry-level wireless audio devices such as wireless earphones, headphones, and Bluetooth speakers. While its feature set is more basic than other chips in the QCC series, it is optimized for energy efficiency and provides essential wireless connectivity features.The QCC-3002 supports Bluetooth 5.0, which offers faster data transfer, increased range, and a more stable connection compared to earlier versions. While the QCC-3002 does not have advanced DSP (Digital Signal Processing) features, it still includes basic processing for improved audio clarity and reduced noise.

Product description

The Qualcomm QCC-3002-2-68CSP-TR-00-0 is a cost-effective Bluetooth audio chip tailored for entry-level wireless audio devices. It strikes a balance between affordability and essential performance, providing manufacturers with a solution for delivering reliable Bluetooth connectivity and basic audio functionality in budget-friendly products like wireless earbuds and portable speakers.

The QCC-3002 supports Bluetooth 5.0, which brings significant improvements over older Bluetooth versions. With enhanced data transfer rates, increased range, and better overall connection stability, Bluetooth 5.0 ensures a smooth and uninterrupted wireless experience. This is especially useful in environments with multiple competing signals, where a stable connection is needed for consistent audio playback.

While the QCC-3002 does not feature advanced DSP capabilities, it still offers basic digital signal processing for noise reduction and audio clarity. The DSP ensures acceptable sound quality for both music playback and voice calls, making it a good fit for general consumer audio products. The basic DSP also helps with features like echo cancellation and simple audio adjustments, ensuring that even budget-friendly devices deliver decent audio performance.

The QCC-3002’s 68-pin CSP package allows it to be integrated into small devices, giving manufacturers the flexibility to design compact and lightweight audio products without compromising functionality. The chip’s wide operating temperature range (-40°C to +85°C) also ensures that it can be used in various conditions, from indoor consumer electronics to outdoor portable devices.

Specification parameters

  • Bluetooth Version: Bluetooth 5.0, with backward compatibility to previous versions


  • Core Processor: 32-bit low-power CPU optimized for wireless audio applications


  • Digital Signal Processor (DSP): Basic DSP functionality for standard audio enhancements


  • Audio Codecs Supported: SBC (Subband Coding) for basic audio streaming


  • Memory: Integrated ROM and RAM for efficient data handling


  • Power Management: Designed for low-power operation to extend device battery life


  • Operating Voltage Range: 1.8V to 3.6V


  • Package Type: 68-pin CSP (Chip Scale Package), providing a compact and space-saving design


  • Wireless Technology: Qualcomm TrueWireless Stereo for synchronized left-right earbud audio transmission


  • Operating Temperature Range: -40°C to +85°C, allowing for use in a wide range of environmental conditions


  • Low Latency: Supports low-latency applications, ideal for wireless earphones in multimedia and gaming contexts


Product view

Related products