The Qualcomm QCC-3024-0-CSP90-TR-00-0 is engineered to offer a cost-effective yet high-performance solution for wireless audio devices. It incorporates Bluetooth 5.0 technology to deliver a robust and reliable wireless connection. This version of Bluetooth ensures that users experience faster pairing times, extended range, and improved data transfer, which collectively contribute to a better audio streaming experience.

One of the standout features of the QCC3024 is its support for TrueWireless Stereo (TWS) technology. TrueWireless Stereo allows for wireless synchronization of audio between the left and right earbuds, eliminating the need for a primary master device and enabling both earbuds to operate independently. 

For audio processing, the QCC3024 integrates Qualcomm’s Kalimba DSP (Digital Signal Processor), which handles advanced audio tasks efficiently. This DSP enables features such as enhanced audio playback, noise reduction, and echo cancellation, contributing to a better overall audio experience for users.

Housed in a CSP90 package, the QCC3024 is designed to fit into compact and space-constrained devices. Despite its small size, it delivers a range of features that support high-quality audio performance and efficient connectivity. The operating temperature range of -40°C to +85°C ensures that the SoC performs reliably across various environmental conditions.