Product description
The Qualcomm QCC-3026-0-81WLNSP-MT-00-0 is a Bluetooth 5.0 SoC designed for affordable true wireless stereo (TWS) earbuds and other Bluetooth audio devices. It offers manufacturers the ability to design wireless audio products that balance performance, power efficiency, and cost-effectiveness. With its support for key features such as TrueWireless Stereo, aptX audio codec, and low power consumption, the QCC3026 is ideal for budget-friendly wireless audio solutions.
The Bluetooth 5.0 technology embedded in the QCC3026 allows for faster pairing, greater wireless range, and improved data rates while consuming less power than previous Bluetooth versions. Bluetooth 5.0 offers a more reliable connection between wireless earbuds and the source device (e.g., smartphone, tablet), making the QCC3026 suitable for a variety of wireless audio applications.
A standout feature of the QCC3026 is its support for TrueWireless Stereo (TWS) technology. TrueWireless enables the wireless synchronization of audio across two earbuds without the need for a master-slave relationship. This means either earbud can act as the primary connection to the source device, with the other earbud seamlessly synchronizing with it.
The QCC3026 is housed in an 81-WLNSP (Wafer Level Near-Chip-Scale Package), which allows it to be integrated into small form factor devices such as TWS earbuds. Despite its compact size, the SoC delivers robust performance, combining high-quality audio with low power consumption and reliable Bluetooth connectivity.
Specification parameters
SoC Type: Bluetooth Audio SoC
Bluetooth Version: 5.0
Audio Codecs Supported: aptX, SBC
DSP Cores: Qualcomm Kalimba DSP core for efficient audio processing
TrueWireless Stereo (TWS): Supports stereo wireless audio for true wireless earbuds
Power Management: Ultra-low-power design for extended battery life
I/O Interfaces: I2S, PCM, UART, USB for various connectivity options
Operating Voltage: 1.8V to 3.3V, optimized for low-power operation
Package Type: 81-WLNSP (Wafer Level Near-Chip-Scale Package), designed for compact devices
Operating Temperature: -40°C to +85°C, ensuring reliable operation in a wide range of environments