Bluetooth Audio SoC

QCC-3042-0-CSP90B-TR-01-0

  • The Qualcomm QCC-3042-0-CSP90B-TR-01-0 is a versatile, low-power Bluetooth audio SoC (System-on-Chip) designed for affordable wireless audio devices like true wireless stereo (TWS) earbuds, headphones, and other compact Bluetooth audio products.This SoC supports Bluetooth 5.1, offering improved connectivity, faster pairing, and extended range compared to older versions, while also reducing power consumption.Optimized for TWS devices, the QCC3042 provides synchronized stereo audio, ensuring a seamless listening experience with minimal lag between the two earbuds.

产品描述

The Qualcomm QCC-3042-0-CSP90B-TR-01-0 is part of Qualcomm's QCC30xx series, specifically targeting the entry-level and mid-tier segments of the true wireless stereo (TWS) market. It is designed to meet the growing demand for affordable yet feature-rich wireless audio products by offering essential audio features like aptX, Bluetooth 5.1, and TrueWireless Mirroring at a competitive cost.

One of the standout features of the QCC3042 is TrueWireless Mirroring, which ensures that the connection between the two earbuds remains stable. This is especially important in environments where connectivity can be unstable, such as busy urban areas with many wireless signals.

The SoC’s Bluetooth 5.1 capability provides improved connection reliability, faster pairing, and enhanced range compared to previous Bluetooth versions. This feature is particularly beneficial in busy environments where signal interference is common, ensuring that users maintain a stable connection while moving or commuting.

In terms of hardware, the CSP90B package is compact and designed to fit within the small, space-constrained form factors typical of TWS earbuds and wireless headphones. This makes the QCC3042 an excellent choice for manufacturers looking to create sleek and lightweight designs without compromising on performance or battery life.

规格参数

  • SoC Type: Bluetooth Audio SoC


  • Bluetooth Version: 5.1


  • Audio Codecs Supported: aptX, SBC


  • DSP Cores: Qualcomm Kalimba DSP core for efficient audio processing


  • TrueWireless Mirroring: Supports seamless switching between earbuds for uninterrupted audio


  • Power Management: Low-power architecture for prolonged battery life in compact audio devices


  • I/O Interfaces: I2S, PCM, UART, and USB for versatile data and audio connectivity


  • Operating Voltage: 1.8V to 3.3V for low-power applications


  • Package Type: CSP90B (Chip-Scale Package), ideal for space-constrained designs like TWS earbuds


  • Operating Temperature: -40°C to +85°C, allowing reliable operation in a wide range of environments


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