Bluetooth Audio SoC

QCC-3044-0-CSP90B-TR-01-0

  • The Qualcomm QCC-3044-0-CSP90B-TR-01-0 is a mid-range Bluetooth audio SoC designed for true wireless stereo (TWS) earbuds and other wireless audio devices. It is part of Qualcomm's QCC30xx series and offers a combination of advanced audio processing, low power consumption, and robust wireless connectivity. This SoC is ideal for devices that need high-quality audio performance while maintaining energy efficiency. With Bluetooth 5.2, providing faster connections, better range, and improved stability over earlier Bluetooth versions.

Product description

The Qualcomm QCC-3044-0-CSP90B-TR-01-0 SoC is a versatile solution that delivers high-quality audio performance in mid-range true wireless stereo (TWS) earbuds and wireless headphones. It is engineered to provide manufacturers with the tools they need to produce cost-effective, energy-efficient devices that still offer premium audio features.

A standout feature of the QCC3044 is Qualcomm TrueWireless Mirroring, which ensures that both earbuds maintain a mirrored connection to the audio source. This means that if one earbud loses its connection, the other will instantly take over without interrupting the user’s listening experience. 

The SoC’s Bluetooth 5.2 support enables faster pairing, stronger connections, and a broader range for wireless audio transmission. This version of Bluetooth also brings enhanced features such as LE Audio, which offers higher-quality audio with reduced latency and power consumption. When it comes to voice communication, the QCC3044 excels with its Clear Voice Capture (CVC) technology. This feature is particularly beneficial for users making calls in noisy environments. 

With its compact CSP90B package, the QCC3044 is perfect for manufacturers who need to design small and lightweight devices without sacrificing performance. Despite its size, it offers a full suite of features that provide a premium audio experience for consumers.

Specification parameters

  • SoC Type: Bluetooth Audio SoC


  • Bluetooth Version: 5.2


  • Audio Codecs Supported: aptX, AAC, SBC


  • DSP Cores: Dual Qualcomm Kalimba DSP cores for audio processing and energy-efficient operation


  • Memory: Embedded flash memory for firmware updates and device customization


  • Audio Processing: aptX codec, Qualcomm TrueWireless Mirroring, Qualcomm Clear Voice Capture (CVC)


  • Power Management: Ultra-low-power architecture for optimized battery life in small devices such as TWS earbuds


  • Operating Voltage: 1.8V to 3.3V for low-power operation


  • Package Type: CSP90B (Chip-Scale Package), designed for compact, lightweight wireless audio devices


  • Operating Temperature: -40°C to +85°C, making it suitable for various operating environments


  • Dimensions: Compact design to fit small form-factor devices like earbuds


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