Product description
The Qualcomm QCC-3046-0-WLNSP94B-HR-00-0 is part of Qualcomm's QCC30xx series, engineered specifically to meet the demands of affordable true wireless stereo (TWS) earbuds and wireless headphones. It is tailored for manufacturers seeking to create cost-effective audio devices while maintaining robust performance and a quality audio experience.
One of the key features of the QCC3046 is its TrueWireless Mirroring technology. This feature ensures that only one earbud is actively connected to the source device (like a smartphone), while the other earbud mirrors the connection.
With Bluetooth 5.2 support, the QCC3046 offers improved data transmission rates, extended range, and more stable connections. The LE Audio support means lower latency, better audio synchronization, and reduced power consumption, making it perfect for applications like hearing aids, as well as low-power wireless audio devices.
The compact WLCSP94B package ensures that the SoC can be embedded in small, space-constrained designs like earbuds, where size and weight are critical factors. Despite its small form factor, the QCC3046 packs enough performance to deliver a reliable, high-quality audio experience.
Specification parameters
SoC Type: Bluetooth audio SoC
Bluetooth Version: 5.2
Audio Codecs: Supports aptX, SBC, AAC
DSP Cores: Dual Qualcomm Kalimba DSPs for efficient and low-latency audio processing
Power Management: Optimized for ultra-low-power consumption to extend battery life in compact wireless earbuds
TrueWireless Mirroring: Ensures seamless connectivity and uninterrupted audio stream between earbuds
Multipoint Connectivity: Allows the SoC to connect to two devices at the same time, like a smartphone and a laptop, switching between them effortlessly.
Audio Sharing: Compatible with audio-sharing features, enabling multiple users to connect to the same audio stream across different devices.
I/O Interfaces: Supports I2S, PCM, UART, and USB interfaces for flexible audio and data transmission
Operating Voltage: 1.8V to 3.3V, supporting low-power operation
Package Type: WLCSP94B (Wafer-Level Chip-Scale Package) for compact and lightweight designs
Operating Temperature: Between -40°C to +85°C, suitable for a variety of usage conditions
