Bluetooth Audio SoC

QCC-3050-0-CSP90B-TR-00-0

  • The Qualcomm QCC-3050-0-CSP90B-TR-00-0 is a highly integrated, low-power Bluetooth audio SoC designed to deliver a superior audio experience for wireless earbuds, headphones, and speakers.The QCC3050 features Qualcomm's aptX Adaptive audio codec technology, which dynamically adjusts audio bitrates based on connection quality to ensure consistent, high-quality sound without noticeable drops or lag.With Bluetooth 5.2, the SoC supports advanced audio sharing features, allowing multiple devices to connect to the same source and share the same audio stream.

产品描述

The Qualcomm QCC-3050-0-CSP90B-TR-00-0 is part of Qualcomm's portfolio of highly versatile and feature-rich Bluetooth SoCs, targeting the wireless audio market. Designed primarily for use in true wireless stereo (TWS) earbuds and wireless headphones, the QCC3050 provides the necessary processing power to deliver high-fidelity audio while maintaining a small, power-efficient form factor.

The integration of Qualcomm's aptX Adaptive codec ensures that audio quality remains pristine regardless of fluctuating network conditions. This codec adapts the bit rate dynamically, providing high-resolution audio when conditions allow and lowering the bit rate seamlessly when bandwidth is restricted. This ability makes the QCC3050 ideal for users who demand high-quality sound on the go, whether streaming music or engaging in voice calls.

Additionally, Bluetooth 5.2 brings support for LE Audio and audio sharing capabilities, a forward-thinking feature that allows users to pair multiple devices and share the same audio stream across different headphones.

The DSP cores embedded within the QCC3050 enable advanced digital signal processing, supporting features like noise cancellation and echo suppression using Qualcomm's CVC technology.

规格参数

  • SoC Type: Bluetooth audio SoC


  • Bluetooth Version: 5.2


  • Supported Audio Codecs: aptX Adaptive, aptX Classic, AAC, SBC


  • DSP Cores: Dual-core Qualcomm Kalimba DSP for enhanced audio processing and low-latency operations


  • Memory: Embedded flash memory for firmware and updates


  • Audio Processing Features: aptX Adaptive, aptX Classic, Qualcomm TrueWireless Mirroring, Qualcomm Clear Voice Capture (CVC)


  • Power Management: Integrated low-power audio DSP and energy-efficient components to support long battery life in wireless audio devices


  • Physical Package: CSP90B (Chip-Scale Package), designed for compact and lightweight device designs


  • Operating Voltage: 1.8V to 3.3V range, suitable for low-power applications


  • I/O Support: Support for I2S, PCM, UART, and USB interfaces for audio and data transmission


  • Temperature Range: Operating temperature between -40°C to +85°C, making it reliable for various environments


  • Dimensions: Ultra-compact CSP (Chip-Scale Package) format to fit within small earbuds and headphone designs


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