Bluetooth Audio SoC

QCC-3056-0-WLNSP94B-TR-02-0

  • The Qualcomm QCC-3056-0-WLNSP94B-TR-02-0 is part of the QCC30xx series, designed specifically for use in True Wireless Stereo (TWS) earbuds and portable audio devices, with a focus on power efficiency and high-performance audio. The SoC supports built-in ANC, allowing manufacturers to integrate high-quality noise cancellation directly into the earbuds without additional hardware.It supports Bluetooth 5.2, enhancing connection stability, data transfer rates, and power efficiency. It also supports LE Audio, improving the audio experience with lower power consumption.

Product description

The Qualcomm QCC-3056-0-WLNSP94B-TR-02-0 is a highly integrated and power-efficient Bluetooth audio SoC, specifically designed for wireless audio devices such as True Wireless Stereo (TWS) earbuds, headphones, and portable speakers. It combines advanced Bluetooth 5.2 functionality, high-performance audio processing, and ultra-low power consumption, making it an ideal choice for manufacturers seeking to create premium wireless audio products with long battery life.

One of the most significant advantages of the QCC3056 is its support for Bluetooth 5.2, which brings improvements in both connection stability and power efficiency. Additionally, the inclusion of LE Audio enhances audio quality while reducing power consumption, making it an excellent feature for energy-sensitive devices like TWS earbuds.

The QCC3056 also supports Active Noise Cancellation (ANC), allowing manufacturers to integrate high-quality noise cancellation directly into their devices without the need for additional hardware. 

The SoC is optimized for voice assistant integration, enabling smooth hands-free interaction with popular digital assistants like Google Assistant and Amazon Alexa.

The WLNSP packaging makes the QCC3056 a great fit for compact designs, such as TWS earbuds and slim wireless headphones. The small package size allows manufacturers to create space-efficient products without compromising performance or battery life.

Specification parameters

  • Package Type: WLNSP (Wafer Level No Solder Pad), a compact package ideal for space-constrained designs.


  • Operating Voltage: 1.8V for core and 3.3V for I/O, optimizing power consumption.


  • Bluetooth Version: Bluetooth 5.2 with LE Audio support for improved audio performance and connection stability.


  • Processor: Dual-core 32-bit processor with an integrated DSP for real-time audio and device management.


  • Memory: On-chip RAM with support for external flash for firmware updates.


  • Temperature Range: Operates between -40°C and +85°C, making it suitable for various environmental conditions.


  • Audio Codecs: Supports aptX, aptX Adaptive, AAC, SBC, and TrueWireless Stereo.


  • Interfaces: UART, I²C, SPI, USB, and GPIO interfaces for external connectivity.


  • Power Efficiency: Optimized for low power consumption, ideal for battery-powered devices.


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