Bluetooth Audio SoC

QCC-3071-0-WLNSP99-HR-04-0

  • The Qualcomm QCC-3071-0-WLNSP99-HR-04-0 is part of Qualcomm’s QCC30xx series, specifically designed for wireless audio applications with a focus on True Wireless Stereo (TWS) earbuds and other portable audio products. This SoC supports Bluetooth 5.2, which offers enhanced connection stability, higher data rates, and lower power consumption. The QCC3071 is designed to minimize power consumption, making it ideal for battery-powered devices such as wireless earbuds and headphones.It supports Qualcomm’s aptX Adaptive audio codec, which dynamically adjusts the bitrate to ensure high-quality, low-latency audio streaming.

产品描述

The Qualcomm QCC-3071-0-WLNSP99-HR-04-0 is a highly efficient Bluetooth audio SoC designed for modern wireless audio products, including True Wireless Stereo (TWS) earbuds, wireless headphones, and portable speakers. This SoC combines advanced Bluetooth 5.2 capabilities with power-efficient audio processing to provide a seamless and high-quality audio experience, especially for devices where long battery life is a critical feature.

Supporting Bluetooth 5.2, the QCC3071 offers several key improvements over previous Bluetooth versions. Bluetooth 5.2 includes LE Audio, which optimizes audio transmission, offering higher sound quality with lower power consumption. This is essential for TWS earbuds and wireless headphones, where maintaining a balance between performance and power efficiency is critical for an enhanced user experience. The SoC’s Bluetooth 5.2 capability ensures stable connections, longer range, and faster data rates, improving the overall audio performance.

The SoC’s integrated DSP enables real-time audio processing and supports advanced audio enhancements such as noise suppression, echo cancellation, and custom equalization. These features allow for a personalized audio experience, ensuring that users enjoy the best sound quality whether they are listening to music, taking calls, or using voice assistants.

规格参数

  • Package Type: WLNSP (Wafer Level No Solder Pad) for compact designs.

  • Operating Voltage: 1.8V for core and 3.3V for I/O, ensuring power efficiency.

  • Bluetooth Version: Bluetooth 5.2, supporting LE Audio, faster data transfer rates, and improved connection stability.

  • Processor: Dual-core 32-bit processor with integrated DSP for real-time audio processing and device management.

  • Memory: On-chip memory with support for external flash, allowing for firmware updates and expanded functionality.

  • Temperature Range: Operates in the temperature range of -40°C to +85°C, making it suitable for various environmental conditions.

  • Audio Codecs: Supports aptX, aptX Adaptive, SBC, AAC, and TrueWireless Stereo.

  • I/O Interfaces: UART, I²C, SPI, USB, and GPIO for connectivity with external peripherals and components.

  • Power Efficiency: Ultra-low power consumption optimized for portable, battery-operated devices.


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