Bluetooth Audio SoC

QCC-3086-0-WLNSP99-TR-05-0

  • The Qualcomm QCC-3086-0-WLNSP99-TR-05-0 is a part of the Qualcomm QCC30xx series of Bluetooth audio SoCs, offering a highly efficient and power-saving solution for wireless audio devices. It comes equipped with Bluetooth 5.2, which delivers enhanced speed, range, and connection stability. Designed for battery-powered devices, this SoC is optimized for low energy consumption, extending the battery life of wireless earbuds, headphones, and portable audio devices.

产品描述

The Qualcomm QCC-3086-0-WLNSP99-TR-05-0 is a versatile and power-efficient Bluetooth audio SoC designed to meet the demands of mainstream wireless audio applications. Built on the foundation of Qualcomm’s low-power technology, the QCC3086 offers enhanced performance while significantly extending battery life, making it ideal for devices like wireless earbuds, headphones, and portable speakers.

Bluetooth 5.2 offers LE Audio, a new standard designed to improve audio quality and extend battery life by transmitting audio at lower bitrates without sacrificing quality. This new feature is particularly beneficial for devices like wireless earbuds, where battery life is a primary concern. 

The integrated DSP provides real-time audio processing and enhances various audio functions, including noise suppression, voice control, and audio equalization. This means that the SoC can support advanced features like voice-activated assistants (Google Assistant, Alexa, etc.) and provide an optimized listening experience with tailored audio settings. 

规格参数

  • Package Type: WLNSP (Wafer Level No Substrate Package), ideal for compact wireless audio devices.

  • Operating Voltage: Core voltage of 1.8V and I/O voltage of 3.3V, ensuring efficient power usage.

  • Bluetooth Version: Bluetooth 5.2, supporting Enhanced Data Rate (EDR), Low Energy (LE) Audio, and improved audio sharing.

  • Audio Codecs: Qualcomm aptX™ Adaptive, aptX, aptX HD, AAC, SBC, and Qualcomm TrueWireless Stereo Plus.

  • Processor: 32-bit processor core, along with a DSP for advanced audio processing.

  • Memory: Integrated memory with external storage support for firmware updates and additional features.

  • Temperature Range: Operational from -40°C to +85°C, allowing it to function in diverse environments.

  • Interfaces: Includes UART, I²C, SPI, USB, and GPIO for peripheral integration.

  • Power Efficiency: Designed for ultra-low power usage to extend battery life in portable devices.


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