Bluetooth Audio SoC

QCC-5124-0-CSP90-MT-00-0

  • The Qualcomm QCC-5124-0-CSP90-TR-00-0 is a highly integrated and advanced audio system-on-chip (SoC) designed for a variety of wireless applications. The chip supports Qualcomm’s advanced Active Noise Cancellation (ANC) technology, making it ideal for audio devices that require noise reduction in loud environments, providing a premium audio experience.The QCC5124 is engineered for ultra-low power consumption, enhancing battery life in portable wireless devices.

产品描述

The Qualcomm QCC-5124-0-CSP90-TR-00-0 is a highly versatile and compact audio SoC designed for premium wireless audio devices. Its advanced architecture combines a dual-core 32-bit processor with a dedicated audio DSP, delivering high-performance audio processing while ensuring efficient power usage, which is essential for battery-operated devices such as Bluetooth headphones, true wireless earbuds, and portable speakers.

The QCC5124 is equipped with Bluetooth 5.0, which offers numerous advantages over previous Bluetooth versions, including improved range, faster data throughput, and more robust connectivity. This makes it an excellent choice for audio devices requiring high-quality wireless communication with low latency, such as gaming headsets and multimedia systems.

A standout feature of this SoC is its support for Active Noise Cancellation (ANC). By integrating both feedforward and feedback ANC capabilities, the QCC5124 enhances the user experience in noisy environments, such as crowded public spaces or busy offices. 


规格参数

  • Package Type: CSP-90 (Chip Scale Package), offering compact dimensions for space-constrained applications.

  • Operating Voltage: The SoC operates at a voltage range of 1.8V for core functionalities and 3.3V for I/O functionalities, optimizing power usage for different operations.

  • Bluetooth Version: Bluetooth 5.0 with enhanced data rate (EDR) support.

  • Processor: Dual-core 32-bit application processor with an additional dedicated audio DSP for handling real-time audio tasks.

  • RAM: Integrated memory for efficient processing.

  • Flash: Supports external flash for flexible firmware and storage expansion.

  • Temperature Range: Operational temperature is specified from -40°C to +85°C, making the SoC suitable for a wide range of environmental conditions.

  • Noise Cancellation: Supports both feedforward and feedback Active Noise Cancellation (ANC).

  • Audio Codec Support: aptX, aptX HD, and Qualcomm TrueWireless™ Stereo are supported for seamless wireless audio synchronization.

  • I/O Interfaces: Includes UART, I²C, SPI, USB, and GPIO interfaces for peripheral connectivity.

  • Power Consumption: Ultra-low power consumption, with active power usage optimized for long battery life in wearable devices and audio products.


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