Bluetooth Audio SoC

QCC-5126-0-CSP90-TR-01-0

  • The QCC-5126-0 is packaged in a CSP (Chip Scale Package) format, specifically CSP90. Designed to support advanced wireless communication standards, the QCC-5126-0 enables high-speed data transfer and reliable connectivity. The component integrates multiple functions into a single chip, reducing the need for additional external components. This high level of integration simplifies design and can lead to cost reductions.

产品描述

The Qualcomm QCC-5126-0-CSP90-TR-01-0 is a sophisticated wireless communication component encapsulated in a Chip Scale Package (CSP). The CSP90 package format offers a compact and efficient design, making it well-suited for applications with limited space but requiring high performance and functionality.

This component is designed to support a range of advanced wireless standards, making it versatile for applications in consumer electronics, industrial systems, and automotive technologies. Its high level of integration reduces the need for additional external components, simplifying the overall design and potentially lowering system costs.

Efficient power management is a critical feature of the QCC-5126-0, ensuring suitability for battery-operated and energy-efficient devices. Its reliable performance guarantees high data transmission capabilities and maintains signal integrity even under demanding conditions.


规格参数

    • Package Type: CSP (Chip Scale Package)


  • Electrical Characteristics:

    • Operating Voltage Range: Usually operates within a voltage range of 1.8V to 3.3V. Specific voltage ranges should be confirmed in the datasheet.

    • Power Consumption: Designed for low power consumption; detailed power consumption information is provided in the datasheet.

    • Frequency Range: Supports specific frequency ranges necessary for its communication functions. Exact frequency details are available in the datasheet.

  • Thermal Characteristics:

    • Thermal Resistance: The CSP package design provides good thermal performance, helping manage heat effectively. Specific thermal resistance details are available in the datasheet.

    • Operating Temperature Range: Typically operates within a temperature range of -40°C to 85°C, suitable for a variety of operating environments.

  • Performance Parameters:

    • Data Rate: Capable of supporting high data rates required for modern wireless applications. The exact data rate capabilities are detailed in the datasheet.

    • Signal Integrity: Designed to ensure high signal quality with minimal noise and interference, providing reliable communication.

  • Pin Configuration:

    • Pin Count: 90 pins.

    • Pin Functions: Pins are used for power, ground, input/output, and communication protocols. 


外观图

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