Part Number | Manufacturer | Technology | Capacity | Interface | Voltage | Temperature | Package | Product Status |
---|---|---|---|---|---|---|---|---|
KLMDG8JEUD-B04Q | Samsung | eMMC 5.1 | 128 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 1.2 mm | Mass Production |
KLMDG8JEUD-B04P | Samsung | eMMC 5.1 | 128 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.2 mm | Mass Production |
KLMCG8GESD-B04Q | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 1.0 mm | EOL |
KLMCG8GESD-B04P | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
KLMCG4JEUD-B04Q | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 1.2 mm | Mass Production |
KLMCG4JEUD-B04P | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.2 mm | Mass Production |
KLMCG4JETD-B041 | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 1.0 mm | Mass Production |
KLMBG4GESD-B04Q | Samsung | eMMC 5.1 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
KLMBG4GESD-B04P | Samsung | eMMC 5.1 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
KLMBG2JETD-B041 | Samsung | eMMC 5.1 | 32 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 0.8 mm | Mass Production |
KLMAG2GESD-B04Q | Samsung | eMMC 5.1 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | EOL |
KLMAG2GESD-B04P | Samsung | eMMC 5.1 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |