Network RF Chip

QCN-5022-0-DRQFN100B-TR-00-0

  • The QCN-5022-0-DRQFN100B-TR-00-0 is a high-performance wireless communication module designed by Qualcomm. It is intended for applications requiring reliable and fast wireless connectivity, such as in consumer electronics, industrial systems, and automotive applications.

Product Description

The QCN-5022-0-DRQFN100B-TR-00-0 is a specialized RF (Radio Frequency) front-end IC, typically used in wireless communication systems. It is designed to handle high-frequency signals, making it suitable for applications like 5G, Wi-Fi, or other advanced communication technologies. This component is housed in a DRQFN100B package, which is compact and ideal for densely populated circuit boards.

Specification

  • Operating Frequency: Typically in the GHz range, depending on the specific use case (e.g., 2.4 GHz, 5 GHz, or higher).


  • Power Supply: Operates at low voltages, typically between 1.8V to 3.3V.


  • Operating Temperature: Designed for a wide range, possibly from -40°C to 85°C, suitable for industrial and commercial environments.


  • Mounting Type: Surface mount technology (SMT) for easy integration onto PCBs.


  • LNA Gain: Typically in the range of 10 dB to 30 dB, helping to amplify weak signals without introducing much noise.


  • PA Gain: Could be 15 dB to 30 dB, depending on the power amplification stage.


  • Voltage Supply (Vcc):Typically operates at 1.8V, 2.5V, or 3.3V DC, depending on the power needs of the system it is integrated into.


  • Package: DRQFN100B: A compact Quad Flat No-lead (QFN) package with dimensions typically around 5 mm x 5 mm to 10 mm x 10 mm. This package offers good thermal dissipation and is optimized for high-density, small-space applications.


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