Network RF Chip

QCN-5024-0-105DRQFN-MT-07-1

  • The QCN-5024-0-105DRQFN-MT-07-1 utilizes a DRQFN package format, which is characterized by its dual-row, quad-flat no-lead design. This component integrates multiple functionalities into a single package. High integration reduces the need for additional external components, simplifying design and potentially reducing overall system costs.It is engineered to provide reliable operation under diverse conditions. It ensures high signal integrity and robust performance, meeting the demands of modern communication technologies.

产品描述

The Qualcomm QCN-5024-0-105DRQFN-MT-07-1 is a sophisticated wireless communication component designed to deliver high performance and reliability. The DRQFN package format provides a compact, low-profile solution with an exposed thermal pad that facilitates effective heat dissipation.


This component is highly integrated, incorporating multiple functions into a single package. This integration reduces the need for additional components and simplifies the design process, which can lead to cost savings and increased design efficiency.


It supports a range of wireless communication standards, making it versatile for use in various applications such as consumer electronics, industrial control systems, and automotive electronics. Its reliable performance is essential for maintaining high signal integrity and ensuring robust data transmission.


规格参数

    • Package Type: DRQFN (Dual Row Quad Flat No-Lead)


  • Electrical Characteristics:

    • Operating Voltage Range: Generally operates within a voltage range of 1.8V to 3.6V. Specific ranges should be verified in the datasheet.

    • Power Consumption: Designed for efficient power usage, with low power consumption suited for battery-operated and energy-efficient applications. Details on power consumption are provided in the datasheet.

    • Frequency Range: The component supports specific frequency ranges essential for its communication functions. The exact frequency capabilities are detailed in the datasheet.

  • Thermal Characteristics:

    • Thermal Resistance: The exposed thermal pad helps in effective heat dissipation, reducing thermal resistance and enhancing the component’s thermal performance.

    • Operating Temperature Range: Typically operates within a range of -40°C to 85°C, suitable for various environmental conditions.

  • Performance Parameters:

    • Data Rate: Supports high data rates necessary for modern communication applications. The exact data rate specifications are provided in the datasheet.

    • Signal Integrity: Designed to maintain high signal quality with minimal noise and interference, ensuring reliable data transmission.

  • Pin Configuration:

    • Pin Count: 100 pins.

    • Pin Functions: Pins are designated for various functions including power, ground, input/output, and communication protocols. 


外观图

5024.jpg

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