Network RF Chip

QCN-5024-0-105DRQFN-TR-07-0

  • The QCN-5024-0-105DRQFN-TR-07-0 is designed in a DRQFN package with a dual-row, quad-flat no-lead configuration. This component integrates multiple functions into a single package, reducing the need for additional external components.Engineered to deliver reliable performance in diverse operating conditions, this component ensures high signal integrity and robust communication capabilities.

Product Description

The Qualcomm QCN-5024-0-105DRQFN-TR-07-0 is a high-performance wireless communication component that combines advanced technology with a compact and efficient design. The DRQFN package format provides a low-profile, space-saving solution while incorporating an exposed thermal pad for enhanced heat management.

The high level of integration in this component allows it to perform multiple functions within a single package, reducing the need for additional external components and simplifying overall system design. This integration is beneficial in applications where space is limited and performance is critical.

With its support for various wireless communication standards, the QCN-5024-0-105DRQFN-TR-07-0 is versatile and suitable for a broad range of applications, including consumer electronics, industrial automation, and automotive systems. Its robust performance characteristics ensure reliable operation and high data transmission capabilities, essential for modern communication technologies.

Specification

    • Package Type: DRQFN (Dual Row Quad Flat No-Lead)


  • Electrical Characteristics:

    • Operating Voltage Range: Typically operates between 1.8V and 3.6V. Specific voltage ranges should be confirmed with the datasheet.

    • Power Consumption: Designed for low power consumption, which is critical for battery-operated and energy-efficient designs. Exact power consumption details are available in the datasheet.

    • Frequency Range: Supports specific frequency ranges necessary for its intended wireless communication functions. The exact frequency capabilities are specified in the datasheet.

  • Thermal Characteristics:

    • Thermal Resistance: The exposed thermal pad aids in effective heat dissipation, reducing thermal resistance and enhancing thermal management.

    • Operating Temperature Range: Typically operates within a temperature range of -40°C to 85°C, making it suitable for a wide range of environmental conditions.

  • Performance Parameters:

    • Data Rate: Capable of handling high data rates required for modern wireless communication applications. Exact data rate capabilities are detailed in the datasheet.

    • Signal Integrity: Designed to ensure high-quality signal transmission with minimal noise and interference, providing reliable communication.

  • Pin Configuration:

    • Pin Count: 100 pins.

    • Pin Functions: Pins are designated for power, ground, input/output, and communication functions. 


Product View

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