Network RF Chip

QCN-5052-2-DRQFN100B-TR-00-0

  • The Qualcomm QCN-5052-2-DRQFN100B-TR-00-0 is a highly integrated wireless communication component designed to provide reliable and efficient connectivity solutions. Its DRQFN100B package format offers a compact and low-profile design, ideal for space-constrained applications while ensuring effective thermal management through its exposed thermal pad.

Product description

The Qualcomm QCN-5052-2-DRQFN100B-TR-00-0 is a highly integrated wireless communication component designed to provide reliable and efficient connectivity solutions.The component supports a range of wireless standards and protocols, making it versatile for various applications, from consumer electronics to industrial and automotive systems.The QCN-5052-2 operates over a wide voltage range and is designed for energy-efficient performance, making it suitable for battery-powered devices. Its robust performance characteristics, including low power consumption and high data rates, ensure reliable operation even in demanding conditions.

Specification parameters

  • Package Information:

    • Package Type: DRQFN100B (Dual Row Quad Flat No-Lead)

    • Package Size: Measures approximately 10mm x 10mm with a 0.5mm pitch.

    • Lead Count: 100 pins, arranged in a dual-row configuration.

  • Electrical Characteristics:

    • Operating Voltage Range: Typically operates within a voltage range of 1.8V to 3.6V.

    • Power Consumption: Low power consumption to support energy-efficient designs. Specific power consumption details would be included in the datasheet.

    • Frequency Range: The exact frequency range supported by the component would be specified, typically covering standard wireless communication bands.

  • Thermal Characteristics:

    • Thermal Resistance: The component features low thermal resistance due to its DRQFN package design, enhancing heat dissipation.

    • Operating Temperature Range: Generally designed to operate within a temperature range of -40°C to 85°C, accommodating various environmental conditions.

  • Performance Parameters:

    • Data Rate: The maximum data rate supported by the component, which is essential for determining its suitability for high-speed communication applications.

    • Signal Integrity: Features such as low signal noise and high signal-to-noise ratio to ensure reliable data transmission.

  • Pin Configuration:

    • Pin Count: 100 pins arranged in a dual-row layout.

    • Pin Functions: Each pin has a specific function related to power, ground, input/output, and communication protocols. Detailed pin functionality is provided in the datasheet.


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