Product Description
The QCN-5054-0-105DRQFN-MT-01-0 is designed for high-performance applications, providing an efficient and compact solution for various electronic systems. This QFN package features a leadless design with contacts located on the bottom of the package, which are soldered directly to the PCB. This design reduces the overall footprint and enhances thermal and electrical performance.The QCN-5054-0-105DRQFN-MT-01-0 is used in diverse fields, including Consumer Electronics,Communications Equipment,Industrial Controls.
Specification
Frequency Support: The QCN5054 supports various frequency bands used in modernwireless communication, including those required for LTE, 5G, and other protocols. Thisbroad frequency support ensures compatibility with global network standards.
Integration Features: The module integrates multiple RF front-end functions such aspower amplifiers (PAs), low-noise amplifiers (LNAs), and duplexers. This integrationreduces the complexity of device design and improves overall performance.
Data Throughput: it supports high data throughput rates, essential for handlingmodern applications that require fast data transfer, such as high-definition videostreaming and large file downloads.
Power Consumption: Designed to be power-efficient, the QCN5054 helps in reducingthe overall power consumption of mobile devices, which contributes to longer batterylife and improved device efficiency.
Package Type: The module comes in a compact package that is easy to integrate intomobile and wireless devices. This compactness is crucial for devices where space islimited.
