Network RF Chip

QCN-6024-0-MSP234-TR-01-0

  • High Performance: The QCN-6024 is designed to provide high-speed data transfer rates, supporting advanced wireless standards such as Wi-Fi 6 (802.11ax). This allows for efficient data handling in high-density environments, ensuring seamless connectivity.
  • Multi-User Support: With support for MU-MIMO (Multi-User, Multiple Input, Multiple Output), the QCN-6024 can handle multiple connections simultaneously. This feature optimizes network efficiency and performance, making it ideal for environments where many devices are connected.
  • Versatile Connectivity Options: The QCN-6024 supports both dual-band (2.4 GHz and 5 GHz) operations, providing flexibility and reducing interference. This allows devices to connect on the less congested 5 GHz band, enhancing overall performance.

Product description

The Qualcomm QCN-6024-0-MSP234-TR-01-0 is a cutting-edge wireless communication module that plays a crucial role in enhancing the connectivity of modern devices. Built on Qualcomm's advanced technology, this module stands out due to its ability to support Wi-Fi 6, which is characterized by significantly improved data rates, increased capacity, and reduced latency compared to its predecessors.

Design and Integration: The module’s compact design allows it to be easily integrated into a wide range of applications, from smartphones to IoT devices. The QCN-6024’s small footprint does not compromise on performance, making it a popular choice among manufacturers aiming to incorporate advanced wireless capabilities without increasing device size.

Enhanced Connectivity Features: One of the standout features of the QCN-6024 is its support for MU-MIMO technology. This allows multiple users to access the network simultaneously without compromising speed or performance. In environments such as homes or offices where multiple devices are connected to the same network, MU-MIMO technology ensures that each device receives optimal bandwidth, enhancing the overall user experience.

Security and Reliability: The module is designed with a strong focus on security. With the integration of WPA3, it provides enhanced protection against unauthorized access and data breaches, which is essential for users who prioritize privacy in their online activities. The module also includes robust error correction techniques, ensuring reliable data transmission even in challenging environments.

Versatility in Applications: The QCN-6024 is not limited to consumer electronics. Its features make it suitable for various applications, including automotive systems, smart home devices, and industrial IoT applications. The ability to operate efficiently in both 2.4 GHz and 5 GHz bands means that it can be tailored to meet the specific connectivity needs of different environments, further enhancing its versatility.

In conclusion, the Qualcomm QCN-6024-0-MSP234-TR-01-0 is a powerful and versatile wireless communication module that embodies advanced technology, making it an ideal choice for a wide range of applications in today's increasingly connected world.


Specification parameters

  1. Chipset Architecture:

    • Processor: Qualcomm Kryo CPU

    • GPU: Integrated Adreno graphics for enhanced multimedia performance.

  2. Wireless Standards:

    • Wi-Fi: Supports IEEE 802.11a/b/g/n/ac/ax

    • Bluetooth: Bluetooth 5.1 support, providing faster data transfer and extended range.

  3. Frequency Bands:

    • 2.4 GHz Band: Supports up to 600 Mbps

    • 5 GHz Band: Supports up to 4.8 Gbps

  4. Dimensions:

    • Size: 20mm x 20mm, facilitating integration into compact devices.

    • Weight: Lightweight, ensuring minimal impact on the device's overall weight.

  5. Power Consumption:

    • Low Power Design: Optimized for low energy consumption, enabling longer battery life in portable devices.

    • Operating Voltage: Typically operates between 3.3V and 5V.

  6. Interfaces:

    • PCIe Interface: Supports high-speed connectivity with host processors.

    • UART, I2C, and GPIO: Allows for various peripheral connections and sensor integration.


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