RF IC

WTR-5975-2-253WLPSP-HR-09-0

  • Multi-Band Operation: Supports a broad range of frequency bands for various wireless communication standards, including LTE, GSM, and WCDMA.
  • High Integration: Integrates multiple RF components such as power amplifiers (PAs), low-noise amplifiers (LNAs), and filters into a single compact module.

Product description

The WTR-5975-2-253WLPSP-HR-09-0 is a sophisticated RF front-end module designed by Qualcomm to enhance the performance of wireless communication systems. It integrates several critical RF functions into a single, compact package, making it highly suitable for modern communication devices that require efficient and reliable performance.

  • Integration of RF Functions: The module combines essential RF components, including power amplifiers (PAs) for boosting transmitted signals, low-noise amplifiers (LNAs) for amplifying weak incoming signals with minimal added noise, and filters to clean up the signal by removing unwanted frequencies and interference. This integration simplifies the design and reduces the number of discrete components needed.

  • High Performance: Designed to deliver efficient power amplification and low noise performance, the module ensures high-quality signal transmission and reception. It is optimized for modern communication standards, providing reliable operation across various frequency bands and communication protocols.

Applications:

  • Mobile Devices: Ideal for use in smartphones, tablets, and other portable communication devices, where space is limited and high performance is required.

  • Wireless Communication Equipment: Suitable for integration into a range of wireless communication systems, including base stations and wireless routers, where multi-band support and efficient RF performance are critical.

  • Consumer Electronics: Can be used in various consumer electronics that require robust wireless connectivity, including wearables and IoT (Internet of Things) devices.


Specification parameters

  • Frequency Range:

    • Supported Bands: Covers a wide range of frequency bands used in global communication standards. Exact bands include LTE (4G), GSM (2G), and WCDMA (3G). Specific frequency ranges are detailed in the datasheet.

  • Operating Frequency Bands:

    • Detailed Bands: Supports various frequency bands essential for worldwide communication, including specific LTE bands, GSM frequencies, and WCDMA bands. The detailed list of supported bands is provided in the technical documentation.

  • Power Output:

    • Transmit Power: Provides efficient amplification for different frequency bands, with specific power output levels designed to meet the requirements of various communication standards.

  • Noise Figure (NF):

    • Low Noise Figure: Features a low noise figure for the Low-Noise Amplifier sections, ensuring minimal additional noise in the received signal, which enhances signal clarity and quality.

  • Gain:

    • High Gain Levels: Delivers high gain for both transmit and receive paths to ensure effective signal amplification. Gain values for different frequency bands are specified in the datasheet.

  • Package Type:

    • Package: 253WLPSP (Wide Leadless Plastic Surface-Mount Package)

    • Form Factor: Compact and space-efficient, designed for integration into high-density electronic assemblies. Detailed dimensions and layout information are provided in the datasheet.

  • Operational Voltage:

    • Voltage Range: Typically operates within standard voltage ranges for RF modules, commonly around 3.3V or 5V. Specific operational voltage details are outlined in the technical documentation.

  • Temperature Range:

    • Operating Temperature: Designed to function reliably within a standard temperature range for consumer electronics, typically between -40°C to +85°C.

  • Regulatory Compliance:

    • Industry Standards: Complies with relevant industry standards and regulations for wireless communication devices, ensuring safe and effective operation.

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