RF IC

WTR-5975-2-253WLPSP-SR-09-0

  • High Integration: Combines several critical RF functions into a single package, including power amplifiers (PAs), low-noise amplifiers (LNAs), and filters, which simplifies the design and enhances performance.
  • Efficient Power Handling: Designed to deliver high efficiency in both transmitting and receiving paths, optimizing power usage and improving overall system performance.

Product description

The WTR-5975-2-253WLPSP-SR-09-0 is an integrated RF front-end module that combines various RF components to support high-performance wireless communication. This module is particularly designed to improve the efficiency and functionality of mobile devices and other wireless equipment by integrating multiple RF functions into a single compact package.

Key components within the module typically include:

  • Power Amplifiers (PAs): To amplify the RF signals for transmission, ensuring strong and clear communication.

  • Low-Noise Amplifiers (LNAs): To boost weak incoming signals with minimal added noise, enhancing signal clarity.

  • Filters: To remove unwanted signals and interference, ensuring only the desired frequencies are processed.

This integration helps in reducing the number of external components needed, which simplifies the design process and enhances the overall performance of the device. The module is optimized for high-speed data transfer and reliable connectivity, making it well-suited for modern smartphones and other high-performance wireless devices.


Specification parameters

  • Frequency Range:

    • Supports a broad range of frequencies across multiple communication bands, including LTE, GSM, and WCDMA.

  • Operating Frequency Bands:

    • Typically includes several frequency bands used in global wireless communication standards. Exact bands and frequencies would be detailed in the datasheet.

  • Power Output:

    • Designed to provide efficient power amplification for various bands, with specific output power levels tailored for different communication standards.

  • Noise Figure (NF):

    • Low Noise Figure for the Low-Noise Amplifier sections, minimizing additional noise in the received signal.

  • Gain:

    • High gain levels for both transmitting and receiving paths to ensure effective signal amplification.

  • Package Type:

    • Package: 253WLPSP (Wide Leadless Plastic Surface-Mount Package)

    • Form Factor: Compact and efficient, suitable for high-density electronic assemblies.

  • Operational Voltage:

    • Typically operates within standard voltage ranges for RF modules, often around 3.3V or 5V.

  • Temperature Range:

    • Designed to function reliably within the standard temperature range for consumer electronics, often -40°C to +85°C.

  • Regulatory Compliance:

    • Complies with industry standards and regulations relevant to wireless communication devices, ensuring safe and effective operation.


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