Wireless Communication Module

WCN-3950-0-58WLPSP-SR-04-1

  • Integrated Wireless Technologies: Combines both Bluetooth and Wi-Fi capabilities in a single module, allowing for comprehensive wireless communication solutions.
  • Bluetooth 4.2: Supports Bluetooth 4.2, offering improved data transfer speeds, range, and power efficiency compared to previous Bluetooth versions.

产品描述

The Qualcomm WCN-3950-0-58WLPSP-SR-04-1 is an advanced wireless communication module that integrates Bluetooth 4.2 and Wi-Fi 4 (802.11n) technologies, providing a reliable and efficient connectivity solution.


Bluetooth 4.2: The module features Bluetooth 4.2, which brings several improvements over earlier versions. Bluetooth 4.2 offers faster data transfer rates, extended communication range, and enhanced power efficiency. It supports both Classic Bluetooth, ideal for high-speed data transfers, and Bluetooth Low Energy (BLE), which is designed for low-power, intermittent communication. Bluetooth 4.2 also includes improved data packet size and privacy features, enhancing overall performance and security. This makes the WCN-3950-0-58WLPSP-SR-04-1 suitable for a variety of applications, including wireless audio, health monitoring devices, and smart peripherals.


Wi-Fi 4 (802.11n): The module includes support for Wi-Fi 4 (802.11n), providing stable wireless networking on the 2.4 GHz frequency band. With data rates up to 150 Mbps, Wi-Fi 4 offers reliable performance for standard networking tasks, such as internet access and file transfers. While it does not match the speeds of newer Wi-Fi standards like Wi-Fi 5 (802.11ac) or Wi-Fi 6 (802.11ax), it is still effective for many applications requiring dependable connectivity.


SR (Standard Reliability) Variant: The WCN-3950-0-58WLPSP-SR-04-1 is classified as a standard reliability (SR) variant, which means it is designed to meet general reliability requirements. It is suitable for applications that demand robust performance under typical conditions. The standard reliability designation ensures that the module delivers consistent performance and durability in a wide range of environments.


Compact Design: The module’s compact form factor allows it to be easily integrated into devices with limited space. Its small size makes it ideal for use in consumer electronics, wearables, and other portable devices where space constraints are a factor. The compact design helps reduce the overall footprint of the device and provides flexibility in design and layout.


Low Power Consumption: Optimized for low power consumption, the WCN-3950-0-58WLPSP-SR-04-1 is well-suited for battery-operated and portable devices. Its energy-efficient design helps extend battery life and minimizes heat generation, which is crucial for maintaining performance and longevity in power-sensitive applications.


Versatility: By integrating both Bluetooth and Wi-Fi technologies, the WCN-3950-0-58WLPSP-SR-04-1 offers a versatile solution for various connectivity needs. This integration makes the module suitable for a broad range of devices, including consumer electronics, IoT devices, and industrial applications, delivering comprehensive wireless connectivity in a single module.


In summary, the Qualcomm WCN-3950-0-58WLPSP-SR-04-1 is a high-performance wireless communication module that combines Bluetooth 4.2 and Wi-Fi 4 (802.11n) technologies. It offers reliable connectivity, a compact design, and low power consumption, making it an excellent choice for applications requiring both Bluetooth and Wi-Fi capabilities with standard reliability.


规格参数

  • Bluetooth:

    • Version: Bluetooth 4.2

    • Features: Supports Classic Bluetooth and Bluetooth Low Energy (BLE).

    • Range: Typically up to 100 meters, depending on the environment.

  • Wi-Fi:

    • Standard: Wi-Fi 4 (802.11n)

    • Frequency Band: 2.4 GHz

    • Data Rates: Up to 150 Mbps

    • Features: Reliable performance for general networking needs.

  • Interfaces:

    • Serial Interfaces: UART, SPI, I2C

    • Power Supply: Operates within a voltage range of 1.8V to 3.3V.

    • Package Type: Compact design for easy integration.

  • Operating Temperature:

    • Range: Typically -40°C to +85°C, ensuring reliable performance across a broad range of environmental conditions.


外观图

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