Product description
The Qualcomm WCN-3998-1-116WLPSP-TR-0T-1 is a highly integrated wireless communication module that caters to the increasing demand for connected devices across various sectors. Its compact design and integration of multiple wireless technologies make it an attractive solution for manufacturers looking to enhance their products with advanced connectivity features.
The module's support for the latest wireless standards ensures compatibility with a wide range of devices and networks, while its low power consumption is crucial for extending the operational life of battery-powered applications. The advanced features, such as MU-MIMO and beamforming, further enhance its performance, allowing for better data throughput and connection stability.
In addition, the WCN-3998-1 is built to withstand challenging environmental conditions, making it suitable for applications in automotive, industrial, and outdoor settings. Its robust design and versatile connectivity options position it as a leading choice for developers aiming to create innovative and reliable connected solutions.
Overall, the Qualcomm WCN-3998-1-116WLPSP-TR-0T-1 stands out as a powerful and efficient wireless communication module, providing the necessary features and specifications to meet the demands of modern connected applications.
Specification parameters
Wireless Standards: The module supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth 5.0, allowing for flexible connectivity and improved performance in congested environments. This dual-band capability helps mitigate interference and enhances overall network reliability.
Interface Compatibility: The WCN-3998-1 offers multiple interface options, including SDIO for Wi-Fi and Bluetooth connectivity, and UART for GNSS. This flexibility allows for easy integration into a variety of hardware platforms and systems.
Environmental Resilience: The module is designed to operate in a wide temperature range, typically from -40°C to +85°C, making it suitable for use in harsh environments, such as automotive and industrial applications.
