Product Description
The Qualcomm QPA-8842-4-11ELGA-HR-03-0 is an advanced RF power amplifier designed to provide high performance and versatility for modern communication systems. Here’s a detailed look at its design, functionality, and applications:
Design and Materials: The QPA-8842-4-11ELGA-HR-03-0 is constructed using high-quality semiconductor materials and advanced fabrication techniques. This design ensures that the amplifier operates efficiently across high frequencies and delivers reliable performance. The choice of materials also contributes to its low noise figure and high linearity, which are critical for effective signal amplification.
Operational Characteristics: With a broad frequency range of 4.0 GHz to 5.0 GHz, the QPA-8842-4-11ELGA-HR-03-0 is highly versatile, making it suitable for various communication technologies such as 5G and advanced Wi-Fi systems. The amplifier provides a high gain of approximately 26 dB and can deliver up to 37 dBm (5 watts) of output power. This combination of high gain and output power ensures that even weak input signals are amplified effectively, enhancing the overall performance of the communication system.
Thermal Management: Effective thermal management is a key feature of the QPA-8842-4-11ELGA-HR-03-0. With a thermal resistance of about 15°C/W, the amplifier is designed to dissipate heat efficiently, preventing overheating and maintaining consistent performance. This capability is crucial for ensuring the amplifier operates reliably under high-power conditions.
Integration and Packaging: The 11-pin ELGA package provides a compact and efficient solution for integrating the amplifier into electronic systems. The ELGA packaging format offers reliable electrical performance and a smaller footprint on the PCB, which is advantageous for space-constrained designs.
Applications: The QPA-8842-4-11ELGA-HR-03-0 is ideal for high-frequency communication applications, including 5G base stations, advanced Wi-Fi systems, and other high-power transmission technologies. Its high output power and low noise figure make it suitable for scenarios requiring robust signal strength and high signal quality.
Reliability and Durability: The amplifier is designed to operate reliably in various environmental conditions. Its robust construction ensures durability and consistent performance over time, even in challenging environments.
In summary, the Qualcomm QPA-8842-4-11ELGA-HR-03-0 is a high-performance RF power amplifier that combines advanced features with reliable operation. Its wide frequency range, high gain, and effective thermal management make it a valuable component for modern communication systems that require powerful amplification and superior signal clarity.
Specification
Frequency Range: The amplifier covers a frequency range from 4.0 GHz to 5.0 GHz, making it suitable for high-frequency communication technologies and applications.
Gain: It provides a high gain of approximately 26 dB. This level of gain is essential for amplifying weak input signals to a higher output level, thereby enhancing overall system performance.
Output Power: The QPA-8842-4-11ELGA-HR-03-0 can deliver up to 37 dBm (5 watts) of output power. This substantial power output is suitable for applications requiring robust signal strength and extended coverage.
Noise Figure: The amplifier features a low noise figure of around 1.8 dB. A low noise figure ensures that the amplifier adds minimal noise to the signal, preserving the quality and clarity of the transmitted data.
Power Supply Voltage: It operates with a power supply voltage ranging from 7V to 14V. This flexibility allows for various power management configurations and system designs.
Thermal Resistance: The amplifier has a thermal resistance of approximately 15°C/W, indicating effective heat dissipation capabilities. This helps in maintaining stable operation and extending the device’s lifespan.
Package Type: The QPA-8842-4-11ELGA-HR-03-0 is housed in an 11-pin ELGA (Enhanced Land Grid Array) package. This compact packaging format supports reliable electrical connections and efficient use of space on printed circuit boards (PCBs).
