RF IC

QDM-3640-0-26LGA-TR-00-0

  • Low Power Consumption: This module emphasizes energy efficiency, allowing it to operate at low power levels. Its carefully optimized design makes it suitable for battery-powered devices, extending their operational life and reducing the frequency of recharges.
  • Flexible Connectivity Options: The QDM-3640-0 supports a variety of communication protocols, including 5G, Wi-Fi 6, and Bluetooth 5. This versatility ensures that devices equipped with this module can connect seamlessly in different environments, catering to a wide range of applications.
  • Compact and Robust Design: Housed in a 26-pin LGA (Land Grid Array) package, the QDM-3640-0 is compact yet robust, making it ideal for integration into space-constrained devices. Its design optimizes thermal performance, ensuring reliable operation even under demanding conditions.

Product description

The Qualcomm QDM-3640-0-26LGA-TR-00-0 is a state-of-the-art semiconductor module tailored for high-performance applications across multiple sectors, including consumer electronics, telecommunications, and industrial automation. Built on Qualcomm's advanced technology, this module combines exceptional processing power, energy efficiency, and robust connectivity options, making it an ideal choice for innovative device developers.

At its core, the QDM-3640-0 boasts a powerful processor capable of operating at frequencies up to 3.0 GHz. This high-performance capability not only supports complex computations but also facilitates smooth multitasking across various applications, from high-definition video processing to real-time data analytics. Its ability to handle substantial workloads makes it suitable for next-generation applications that demand both speed and efficiency.

Energy efficiency is a hallmark of the QDM-3640-0. With a power supply voltage of just 1.2V, the module is adept at minimizing power consumption without compromising performance. This characteristic is particularly beneficial for battery-operated devices where longevity is crucial; users can enjoy extended usage times before needing to recharge, which enhances the overall user experience.

Connectivity is another key feature of the QDM-3640-0, which supports the latest communication standards, including 5G, Wi-Fi 6, and Bluetooth 5. This multi-connectivity capability enables devices to maintain fast and reliable connections in various scenarios, whether it be for streaming high-definition content, participating in real-time online gaming, or connecting to IoT networks. The flexibility of connectivity ensures that developers can create versatile devices that cater to diverse user needs.

The compact design of the QDM-3640-0, encapsulated in a 26-pin LGA package, not only saves space but also enhances thermal management. Effective heat dissipation is critical for maintaining performance during intensive operations, and the QDM-3640-0 is engineered to remain cool under load. This reliability makes it suitable for use in both consumer electronics and industrial applications, where durability is vital.

Security in digital communications is paramount, and the QDM-3640-0 addresses this with advanced built-in security features. The module includes robust encryption and authentication protocols, which safeguard sensitive data against unauthorized access and cyber threats. This level of security is especially important in sectors such as healthcare, finance, and any application that involves personal or sensitive information.

Operating effectively across a wide temperature range of -40°C to +85°C, the QDM-3640-0 is built to withstand harsh environmental conditions. This durability makes it particularly suited for industrial applications, outdoor devices, and environments where temperature fluctuations are common.

In summary, the Qualcomm QDM-3640-0-26LGA-TR-00-0 represents a significant advancement in semiconductor technology, offering a combination of high performance, energy efficiency, versatile connectivity, and robust security. These features make it an excellent choice for manufacturers looking to develop cutting-edge devices that meet the varied demands of today’s market, from mobile communications to smart industrial solutions.


Specification parameters

  1. Package Type: LGA26

    • The 26-pin Land Grid Array format allows for efficient electrical connection and effective heat dissipation.

  2. Operating Frequency: Up to 3.0 GHz

    • Capable of processing high-frequency signals, enhancing its performance in data-intensive applications.

  3. Power Supply Voltage: 1.2V ± 10%

    • Designed to minimize energy usage while maintaining high performance, essential for portable devices.

  4. Temperature Range: -40°C to +85°C

    • This wide operating temperature range allows for stable performance in various environmental conditions, suitable for industrial and outdoor applications.

  5. Data Rate Support: Up to 4 Gbps

    • Supports high-speed data transfer requirements, making it ideal for applications that need real-time data processing.

  6. Interface Compatibility: Supports UART, SPI, I2C, and PCIe interfaces

    • Versatile interface options enable easy integration with a broad range of peripherals and systems.


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