Product description
The Qualcomm QDM-4302-0-LGA80+S-TR-01-0 is a cutting-edge semiconductor module that embodies Qualcomm's commitment to innovation and excellence in the field of high-performance computing. Designed for a broad spectrum of applications, this module combines powerful processing capabilities, exceptional energy efficiency, and advanced connectivity options, making it a prime choice for developers striving to create next-generation devices.
At the heart of the QDM-4302-0 is its impressive processing capability, reaching operating frequencies of up to 3.2 GHz. This high-performance specification allows the module to efficiently manage complex calculations and execute multiple tasks simultaneously—essential for applications in artificial intelligence, machine learning, and real-time data analytics.
Energy efficiency is a core focus of the QDM-4302-0. Operating at a nominal voltage of 1.8V, the module is designed to minimize power consumption while delivering outstanding performance. This feature is particularly advantageous for mobile and portable devices, where extended battery life is critical. By optimizing power usage, the module enhances user experience by reducing the need for frequent recharging.
Connectivity is another hallmark of the QDM-4302-0, which supports the latest standards including 5G, Wi-Fi 6, and Bluetooth 5. This multi-protocol support ensures that devices equipped with this module can achieve high-speed, reliable connections, facilitating seamless data transfer and communication. This capability is vital in today’s interconnected world, where robust connectivity is a prerequisite for smart home devices, industrial automation, and IoT applications.
In an increasingly digital landscape, securing sensitive data is more important than ever. The QDM-4302-0 addresses this concern with advanced security features such as hardware-based encryption, secure boot, and trusted execution environments. These safeguards ensure that devices operate securely, protecting against unauthorized access and data breaches. This level of security is particularly crucial for applications in sectors like healthcare and finance, where data integrity and confidentiality are paramount.
The compact LGA80 package design allows for easy integration into a variety of devices, making the QDM-4302-0 a versatile component for developers. This compactness, combined with effective thermal management, allows the module to perform reliably even under heavy loads and in challenging environmental conditions.
With a temperature range of -40°C to +105°C, the QDM-4302-0 is engineered to withstand harsh operating environments. This robustness is essential for applications in industries such as automotive, industrial automation, and outdoor devices, where temperature fluctuations can be significant.
In summary, the Qualcomm QDM-4302-0-LGA80+S-TR-01-0 stands out as a powerful, efficient, and versatile semiconductor module. Its high-performance processing capabilities, extensive connectivity options, and robust security features make it an ideal choice for a wide range of applications, from consumer electronics to advanced industrial solutions. As technology continues to evolve, the QDM-4302-0 is well-positioned to drive innovation and enhance user experiences across various sectors.
Specification parameters
Package Type: LGA80
The Land Grid Array (LGA) package format provides a compact design while ensuring efficient thermal management and reliable electrical connections, facilitating integration into diverse systems.
Operating Frequency: Up to 3.2 GHz
The module operates at high frequencies, enabling it to handle intensive computations and multitasking, which is essential for modern applications requiring rapid processing.
Power Supply Voltage: 1.8V ± 10%
Operating at a relatively low voltage contributes to the overall energy efficiency of the module, making it suitable for various battery-powered devices.
Temperature Range: -40°C to +105°C
With a wide operating temperature range, the QDM-4302-0 is built to perform reliably in diverse environmental conditions, from extreme cold to high heat, making it suitable for outdoor and industrial applications.
Data Rate Support: Up to 5 Gbps
The module supports high data transfer rates, which is crucial for applications requiring rapid communication and processing of large datasets.
Interface Compatibility: Supports various interfaces including UART, SPI, I2C, and PCIe
This compatibility enables seamless integration with a variety of peripherals and systems, facilitating flexibility in device design and functionality.
