RF IC

QDM-5621-0-LGA22B-HR-Y6-0

  • The Qualcomm QDM-5621-0-LGA22B-HR-Y6-0 is a sophisticated communication module designed to meet the demands of modern wireless applications. One of its key features is its support for multiple wireless communication standards, including Wi-Fi, Bluetooth, and cellular technologies. This multi-protocol capability allows for seamless connectivity across various devices and networks, making it an ideal choice for Internet of Things (IoT) applications.

Product description

The Qualcomm QDM-5621-0-LGA22B-HR-Y6-0 is designed to cater to the growing needs of wireless communication in various sectors. Its multi-protocol support allows it to connect seamlessly to different networks, making it a flexible solution for developers and manufacturers. This versatility is particularly beneficial in IoT applications, where devices often need to communicate over different protocols depending on the environment and use case.

The LGA package design of the QDM-5621-0 ensures a compact footprint, which is advantageous for space-constrained applications. The 22-pin configuration provides sufficient connectivity options while maintaining a small size, making it easy to integrate into various circuit boards. The device's robust thermal performance ensures reliable operation even in challenging environments, which is critical for industrial and outdoor applications.

Security is a paramount concern in today's digital landscape, and the QDM-5621-0 addresses this with its advanced security features. The hardware-based encryption capabilities protect sensitive data during transmission, while secure boot functionality ensures that only authorized firmware is loaded, safeguarding against potential threats.

In summary, the Qualcomm QDM-5621-0-LGA22B-HR-Y6-0 is a versatile and reliable communication module that combines advanced features, robust specifications, and a compact design. Its ability to support multiple wireless protocols, coupled with low power consumption and enhanced security, makes it an excellent choice for a wide range of applications in the rapidly evolving technology landscape.


Specification parameters

  • Package Type: LGA (Land Grid Array)

  • Pin Count: 22 pins

  • Operating Voltage: Typically operates within a voltage range of 1.8V to 3.3V, allowing compatibility with various power supply systems.

  • Operating Temperature Range: Designed to function effectively in a temperature range of -40°C to +85°C, making it suitable for both indoor and outdoor applications.

  • Wireless Protocols: Supports multiple wireless communication protocols, including Wi-Fi (802.11 a/b/g/n/ac), Bluetooth (5.0), and cellular connectivity (LTE), enabling versatile applications.

  • Data Rate: Capable of achieving high data rates, essential for applications requiring fast and reliable data transmission.

  • Power Consumption: Features low power consumption modes, which are critical for extending battery life in portable and IoT devices.


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