RF IC

QDM-5677-0-LGA11G-TR-03-0

  • Advanced Multi-Core Architecture: The SoC is built with multiple processing cores that provide superior performance and efficiency, enabling smooth multitasking and enhanced responsiveness in applications.
  • Wi-Fi 6E Support: It supports the latest Wi-Fi 6E technology, which operates in the 6 GHz band. This feature significantly increases bandwidth, reduces latency, and allows for more devices to connect simultaneously without sacrificing performance.
  • Enhanced Security Protocols: Integrated security features include hardware-based encryption, secure boot capabilities, and compliance with advanced security standards such as WPA3, ensuring robust protection against cyber threats.

Product description

The Qualcomm QDM-5677-0-LGA11G-TR-03-0 represents a significant advancement in semiconductor technology, specifically designed to meet the demands of modern wireless communication and networking applications. Its multi-core architecture is a standout feature, allowing for multiple tasks to be processed simultaneously. With a maximum clock speed of up to 3.0 GHz, this SoC can efficiently handle complex computations and heavy data loads, making it ideal for applications ranging from high-performance routers to smart home devices.

A key advantage of this SoC is its support for Wi-Fi 6E, which enhances connectivity by utilizing the newly allocated 6 GHz frequency band. This capability not only increases the available bandwidth but also minimizes interference from other devices operating on lower frequency bands. As a result, users experience faster data transmission rates and more reliable connections, even in environments crowded with multiple connected devices.

Security is paramount in today's digital landscape, and the QDM-5677 addresses these concerns with integrated security features. The hardware-based encryption ensures that data remains protected during transmission, while the secure boot process prevents unauthorized access at startup. Compliance with WPA3 further bolsters the security framework, making the QDM-5677 an excellent choice for environments where data privacy is critical.

Power efficiency is another vital aspect of the QDM-5677's design. Utilizing advanced power management technologies, the SoC optimizes energy usage, which is particularly beneficial for mobile devices like smartphones, tablets, and IoT gadgets. This efficiency helps manufacturers create products with longer battery life, meeting consumer expectations for performance without frequent charging interruptions.

The versatility of the QDM-5677 allows it to be applied across various sectors, including consumer electronics, smart home solutions, and industrial automation. Its compatibility with different memory types and interfaces enables seamless integration into diverse product ecosystems. This adaptability makes it a valuable asset for manufacturers looking to innovate and enhance their offerings.

In summary, the Qualcomm QDM-5677-0-LGA11G-TR-03-0 is a powerful, secure, and energy-efficient SoC designed for the future of networking technology. With its advanced features, robust specifications, and flexible applications, it stands as a leading solution for meeting the growing demands of connectivity in an increasingly interconnected world.


Specification parameters

  • CPU Architecture:

    • Multi-core ARM architecture optimized for performance and efficiency.

  • Maximum Clock Speed:

    • Up to 3.0 GHz, facilitating high-speed data processing for demanding applications.

  • Memory Compatibility:

    • Supports DDR4 and LPDDR4x memory types, enhancing data transfer rates and overall system performance.

  • Wireless Connectivity:

    • Full support for Wi-Fi 6E (802.11ax), providing higher throughput and improved capacity management.

  • Security Features:

    • Hardware-level encryption, secure boot, and adherence to WPA3 standards for enhanced security measures.

  • Power Management:

    • Advanced power management techniques designed to minimize energy consumption while maintaining high performance.

  • Package Type:

    • LGA11G package format, facilitating straightforward integration into various hardware designs.

  • Thermal Management:

    • Designed with effective thermal regulation features to ensure stability under high workloads.


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