RF IC

QDM-6720-0-LGA18+S-HR-C2-0

  • Enhanced Connectivity: This module supports a wide range of wireless communication standards, including LTE and 5G NR, ensuring high-speed data transfer and robust connectivity. It is designed to meet the evolving needs of modern telecommunications.
  • Optimized Power Efficiency: With an emphasis on low power consumption, the QDM-6720 is engineered to operate efficiently in battery-powered applications, helping to prolong device life while maintaining optimal performance.
  • Wide Temperature Range: The module is designed to operate in extreme temperature conditions, from -40°C to +85°C, making it ideal for industrial and automotive applications where reliability in harsh environments is critical.

Product description

The Qualcomm QDM-6720-0-LGA18+S-HR-C2-0 is a cutting-edge communication module designed to cater to the demands of contemporary wireless applications, particularly in IoT, smart cities, and automotive technologies. Its compact LGA18+S form factor allows for easy integration into a variety of devices, making it an excellent choice for manufacturers looking to create sleek, efficient products.

One of the standout features of the QDM-6720 is its support for advanced connectivity options, including LTE and 5G technologies. This versatility is crucial for applications that require high-speed data transfer and low latency, such as real-time data analytics and autonomous vehicle communications. By integrating multiple frequency bands, the module ensures reliable connectivity across diverse networks.

The QDM-6720 also emphasizes power efficiency, a critical factor in today’s mobile and IoT ecosystems. Its low power consumption allows devices to operate longer on battery, addressing a common concern among users of portable electronics. This efficiency is complemented by the module’s ability to function effectively across a wide temperature range, ensuring that it can perform reliably in both extreme heat and cold—ideal for industrial applications.

Moreover, the integrated RF features, including a power amplifier, streamline the design process for engineers, reducing the number of external components required and simplifying assembly. This integration not only saves space but also minimizes potential points of failure, enhancing overall system reliability.

In summary, the Qualcomm QDM-6720-0-LGA18+S-HR-C2-0 stands out as a powerful and flexible solution for a wide array of modern applications. With its combination of compact design, advanced connectivity, and energy-efficient operation, it is well-equipped to meet the challenges of today's fast-paced technological landscape.


Specification parameters

  1. Form Factor: LGA18+S (18 pins) with a compact design for space-constrained applications.

  2. Operating Voltage: Typically operates in the range of 1.8V to 3.3V, accommodating various power supply designs.

  3. Frequency Bands: Supports multiple frequency bands, making it versatile for different communication standards (e.g., sub-6 GHz and mmWave for 5G).

  4. Data Rate: Capable of achieving data rates exceeding 1 Gbps, enabling high-speed data transmission for demanding applications.

  5. Temperature Range: Operating temperature range from -40°C to +85°C, suitable for diverse industrial and outdoor applications.

  6. Antenna Interface: Supports multiple antenna configurations for improved signal strength and reliability.

  7. Compliance: Fully compliant with relevant telecommunications standards, ensuring interoperability with global networks.


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