RF IC

QDM-6720-0-LGA18+S-SR-C4-0

  • Compact Form Factor: The QDM-6720-0-LGA18+S-SR-C4-0 features an LGA (Land Grid Array) design with 18 pins, making it exceptionally space-efficient. This compact size is ideal for integration into devices with limited physical space, such as wearables, IoT devices, and smart sensors.
  • Advanced Connectivity: This module supports multiple wireless communication standards, including LTE and 5G, providing users with high-speed connectivity and low latency. The ability to operate on various frequency bands ensures robust performance across different network environments.
  • Power Efficiency: Designed for low power consumption, the QDM-6720 enables extended battery life for mobile and IoT applications. This efficiency is crucial for devices that rely on battery power, allowing for prolonged use without frequent recharging.

Product description

The Qualcomm QDM-6720-0-LGA18+S-SR-C4-0 represents a state-of-the-art solution for modern wireless communication, tailored for the needs of various applications including Internet of Things (IoT), smart city technologies, and automotive systems. Its compact LGA form factor allows manufacturers to design devices that are not only efficient but also aesthetically pleasing, as it occupies minimal space.

One of the key attributes of the QDM-6720 is its comprehensive support for advanced wireless connectivity, incorporating both LTE and 5G technologies. This versatility is essential for applications that demand high throughput and rapid response times, such as real-time data processing in smart manufacturing or critical communications in autonomous vehicles. The module’s capability to operate across a range of frequency bands ensures that it can adapt to different network configurations and remain effective as standards evolve.

In terms of power efficiency, the QDM-6720 is optimized for low energy consumption, making it ideal for battery-operated devices. This attribute not only helps reduce operational costs but also contributes to the sustainability of devices, as they require less frequent charging. Such energy efficiency is increasingly important in the context of growing environmental concerns and consumer demand for longer-lasting devices.

Moreover, the QDM-6720 is built to withstand challenging environmental conditions, with a wide operational temperature range that makes it suitable for industrial applications. Whether deployed in outdoor sensors or in harsh manufacturing settings, the module’s resilience ensures reliable performance without failure.

The integration of RF components within the QDM-6720 simplifies the overall design process for developers, allowing for quicker deployment of products and reducing the risk of assembly errors. This integration not only saves space but also enhances the overall performance and reliability of the device.

In summary, the Qualcomm QDM-6720-0-LGA18+S-SR-C4-0 is a robust and versatile module that meets the rigorous demands of contemporary wireless communication. With its combination of advanced features, specifications, and thoughtful design, it is positioned to play a significant role in the future of connectivity across various industries.


Specification parameters

  1. Form Factor: LGA18+S (18 pins), compact and efficient for small device integration.

  2. Operating Voltage: Generally operates within a voltage range of 1.8V to 3.3V, accommodating various power supply designs.

  3. Frequency Bands: Supports sub-6 GHz and mmWave frequencies, enabling versatile applications in both LTE and 5G networks.

  4. Data Rate: Capable of achieving data rates exceeding 1 Gbps, facilitating high-speed communication for demanding applications.

  5. Temperature Range: Operational temperature range from -40°C to +85°C, ensuring reliability in extreme conditions.

  6. Antenna Interface: Supports multiple antenna configurations for improved signal strength and quality.

  7. Regulatory Compliance: Fully compliant with relevant telecommunications standards, ensuring compatibility with global networks.


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