RF IC

QPM-2621-0-65DLGA-TR-02-0

  • Wide Frequency Range: The component supports a broad frequency range, allowing it to be used across various communication standards and applications. This versatility ensures that it can be integrated into different systems without needing multiple specialized components.
  • Low Noise Figure: The device has a low noise figure, which is crucial for maintaining the clarity and quality of the signal. This characteristic helps in reducing unwanted noise and interference, thereby enhancing overall system performance.

Product description

The Qualcomm QPM-2621-0-65DLGA-TR-02-0 is a sophisticated RF component tailored for use in advanced communication systems, such as mobile devices, base stations, and other wireless technologies. Here’s a detailed description of its design, application, and performance benefits:

  • Design and Technology: Utilizing advanced semiconductor technology, the QPM-2621-0-65DLGA-TR-02-0 integrates high-performance circuitry within a compact DLGA package. This design approach ensures excellent electrical performance and thermal management, crucial for maintaining stable operation in demanding environments.

  • Applications: The component is versatile and can be employed in various communication systems, including cellular networks, Wi-Fi, and satellite communications. Its broad frequency range and high power efficiency make it adaptable to different standards and requirements, providing flexibility for designers.

  • Thermal Management: The DLGA package not only helps in minimizing the device’s footprint but also contributes to effective thermal management. By efficiently dissipating heat, the package helps in maintaining the device’s performance and reliability, especially in high-power applications.

  • Performance Benefits: The high linearity and low noise figure of the QPM-2621-0-65DLGA-TR-02-0 ensure that signals are transmitted and received with minimal distortion and interference. This performance is crucial for achieving clear and reliable communication, which is essential for modern wireless applications.

  • Integration and Usability: The compact and efficient design of the DLGA package allows for easy integration into various circuit boards and systems. The optimized input and output matching networks further simplify system design by reducing the need for additional components to manage signal reflection and losses.

In summary, the Qualcomm QPM-2621-0-65DLGA-TR-02-0 is a high-performance RF component that excels in power efficiency, signal clarity, and versatility. Its advanced design and compact packaging make it a valuable choice for modern communication systems, ensuring high performance and reliability in a range of applications.


Specification parameters

  • Frequency Range: The QPM-2621-0-65DLGA-TR-02-0 operates over a broad frequency range, typically covering several GHz. Exact frequency ranges and bands are detailed in the datasheet and are designed to meet various communication standards.

  • Gain: The component provides substantial gain to ensure effective signal amplification. This gain is crucial for maintaining signal strength and quality over different distances and conditions.

  • Power Output: Designed to deliver significant power output, the QPM-2621-0-65DLGA-TR-02-0 is suitable for high-power applications. Its power handling capabilities are optimized for both transmission and reception processes.

  • Noise Figure: The device features a low noise figure, often below 1 dB, which is essential for preserving signal integrity. This low noise figure helps in reducing background noise and enhancing overall performance.

  • Input/Output Matching: The integrated circuit includes optimized matching networks for both input and output, which minimizes reflection losses and improves efficiency. This matching is crucial for achieving maximum performance and signal clarity.

  • Package Type: The DLGA (Dual-Layer Grid Array) package provides a compact design with effective thermal and electrical management. This packaging solution supports high-density mounting and helps in efficient heat dissipation.

  • Operating Voltage: The component operates within a standard voltage range compatible with typical communication system power supplies. Specific voltage values are detailed in the datasheet.


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