RF IC

QPM-2632-0-65BLGA-MT-02-0

  • Advanced Power Efficiency: The QPM-2632-0-65BLGA-MT-02-0 is engineered to deliver superior power efficiency, which is crucial for applications requiring minimal energy consumption. This efficiency is beneficial for extending battery life in portable devices and reducing operational costs in various systems.
  • Broad Frequency Range: This RF component supports an extensive frequency range, making it highly versatile for different communication technologies. It is capable of functioning across various frequency bands, allowing it to be used in diverse applications including cellular, satellite, and advanced wireless systems.

Product description

The Qualcomm QPM-2632-0-65BLGA-MT-02-0 is a high-performance RF component designed to meet the needs of modern communication systems. Here’s an in-depth look at its design, applications, and performance benefits:

  • Design and Technology: The QPM-2632-0-65BLGA-MT-02-0 utilizes advanced semiconductor technology to achieve high performance. The BLGA packaging integrates the component into a compact footprint while enhancing thermal and electrical management. This design approach ensures the component operates reliably and efficiently under various conditions.

  • Applications: This RF component is suitable for a wide range of applications, including cellular base stations, mobile devices, and other advanced wireless technologies. Its broad frequency range and high power efficiency make it adaptable to both existing and next-generation communication systems, such as 5G and advanced Wi-Fi networks.

  • Thermal Management: The BLGA package is designed to handle heat dissipation effectively. This capability is crucial for preventing overheating and ensuring that the component operates within its optimal temperature range, especially in high-power and high-frequency applications.

  • Performance Benefits: The high linearity and low noise figure of the QPM-2632-0-65BLGA-MT-02-0 are key to achieving high-quality communication. These attributes ensure minimal signal distortion and interference, resulting in clear and accurate communication.

  • Integration and Usability: The compact BLGA package allows for easy integration into various circuit boards and systems. The optimized input and output matching networks reduce the need for additional components to manage signal reflections and losses, simplifying system design and enhancing overall efficiency.

In summary, the Qualcomm QPM-2632-0-65BLGA-MT-02-0 is a high-performance RF component known for its power efficiency, signal clarity, and versatility. Its advanced design and robust packaging make it an ideal choice for modern communication systems, delivering reliable and high-quality performance across a broad range of applications.


Specification parameters

  • Frequency Range: The device operates over a broad frequency range, typically spanning several GHz. This extensive range supports various communication systems and standards. 

  • Gain: The QPM-2632-0-65BLGA-MT-02-0 provides substantial gain, essential for effective signal amplification. The gain ensures that the signal remains strong and clear, even over long distances or in challenging conditions.

  • Power Output: The component is designed to handle high power output, making it suitable for demanding applications. This high power capability supports both transmission and reception, ensuring reliable performance in various scenarios.

  • Noise Figure: The device features a low noise figure, generally below 1 dB. This low noise figure is crucial for preserving the quality of the received signal by minimizing the additional noise introduced during signal processing.

  • Input/Output Matching: The QPM-2632-0-65BLGA-MT-02-0 includes optimized matching networks for both input and output. These networks minimize reflection losses and enhance overall system efficiency, contributing to optimal performance and signal fidelity.

  • Package Type: The BLGA (Ball Grid Array) package offers a compact and robust design, providing effective thermal management and high-density mounting capabilities. This packaging solution ensures reliable operation even in high-power applications.

  • Operating Voltage: The device operates within a standard voltage range that is compatible with typical communication system power supplies. 

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