RF IC

QPM-2632-0-65BLGA-MT-03-0

  • Wide Frequency Range: This RF component supports a broad frequency range, making it versatile for multiple communication standards and technologies. It is capable of operating effectively across various frequency bands, which is essential for integration with diverse wireless systems, including cellular, Wi-Fi, and satellite communications.
  • Low Noise Figure: The device features a low noise figure, typically below 1 dB. This characteristic is crucial for maintaining high signal quality by minimizing the amount of noise introduced into the signal, which ensures clearer and more reliable communication.

Product description

The Qualcomm QPM-2632-0-65BLGA-MT-03-0 is designed to meet the rigorous demands of modern communication systems. Here’s a thorough examination of its design, applications, and performance benefits:

  • Design and Technology: Utilizing advanced semiconductor technology, the QPM-2632-0-65BLGA-MT-03-0 integrates high-performance circuitry within a durable BLGA package. This design ensures superior electrical and thermal performance, which is crucial for stable operation in demanding conditions.

  • Applications: This RF component is suitable for a wide range of communication applications, including cellular base stations, mobile devices, and other advanced wireless technologies. Its broad frequency range and high power efficiency make it adaptable to various communication standards, such as 5G and next-generation Wi-Fi systems.

  • Thermal Management: The BLGA packaging is designed for effective thermal management, helping to dissipate heat efficiently. This capability prevents overheating and ensures that the component operates within its optimal temperature range, particularly in high-power and high-frequency scenarios.

  • Performance Benefits: The high linearity and low noise figure of the QPM-2632-0-65BLGA-MT-03-0 are essential for achieving high-quality communication. These attributes minimize signal distortion and interference, ensuring that transmitted and received signals are accurate and clear.

  • Integration and Usability: The compact BLGA package allows for straightforward integration into various circuit boards and systems. The optimized input and output matching networks reduce the need for additional components to manage signal reflections and losses, simplifying system design and enhancing overall efficiency.

In summary, the Qualcomm QPM-2632-0-65BLGA-MT-03-0 is a high-performance RF component known for its power efficiency, signal clarity, and versatility. Its advanced design and robust packaging make it an ideal choice for modern communication systems, delivering reliable and high-quality performance across a range of applications.


Specification parameters

The detailed technical specifications of the Qualcomm QPM-2632-0-65BLGA-MT-03-0 define its performance and application suitability:

  • Frequency Range: The component operates over an extensive frequency range, typically spanning several GHz. This broad range allows it to be used in various communication systems. Exact frequency ranges are specified in the datasheet, highlighting its adaptability to different wireless standards and requirements.

  • Gain: The QPM-2632-0-65BLGA-MT-03-0 provides substantial gain, which is essential for effective signal amplification. This gain ensures that signals remain strong and clear, even in challenging environments or over longer distances.

  • Power Output: Designed to handle high power output, the component is suitable for demanding applications. This high power capability supports both transmission and reception, ensuring robust and reliable performance across various scenarios.

  • Noise Figure: The device features a low noise figure, generally below 1 dB, which minimizes the noise added to the signal. This low noise figure is essential for high-quality communication, ensuring that the signal remains clear and interference is reduced.

  • Input/Output Matching: The QPM-2632-0-65BLGA-MT-03-0 includes optimized matching networks for both input and output. These networks minimize reflection losses and enhance overall efficiency, contributing to optimal performance and signal fidelity.

  • Package Type: The BLGA (Ball Grid Array) package provides a compact and robust form factor with effective thermal management. This packaging solution supports high-density mounting and ensures reliable operation even in high-power applications.

  • Operating Voltage: The component operates within a standard voltage range that is compatible with typical communication system power supplies. Specific voltage ranges are detailed in the datasheet, ensuring proper integration with existing systems.


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