RF IC

QPM-5577-0-LGA62B+S-TR-02-0

  • Robust Thermal Management: The QPM-5577-0 features a sophisticated thermal management system within its LGA62B package. This design ensures efficient heat dissipation, enabling reliable performance even at high power levels. The effective thermal handling prevents overheating and maintains consistent operation under demanding conditions.

Product Description

The Qualcomm QPM-5577-0-LGA62B+S-TR-02-0 is a sophisticated power amplifier designed to address the demands of next-generation 5G networks. Its advanced design and robust specifications make it a pivotal component for modern telecommunications systems.

  1. Design and Construction: The LGA62B package of the QPM-5577-0 is meticulously engineered for high-performance applications. The Land Grid Array configuration ensures stable connections between the amplifier and the circuit board, which is essential for maintaining signal integrity and reliability. The compact and durable design optimizes board space usage, making it suitable for high-density environments.

  2. Thermal Management: Effective thermal management is a key feature of the QPM-5577-0. The amplifier’s design incorporates advanced cooling technologies to manage the heat generated during operation. The LGA62B package facilitates efficient heat dissipation, which prevents overheating and ensures consistent performance. This thermal efficiency is critical for high-power applications where managing heat is a significant challenge.

  3. Applications: The QPM-5577-0 is ideal for a variety of 5G applications, including base stations, repeaters, and other critical network infrastructure components. Its high output power and gain make it suitable for scenarios requiring strong signal amplification and extended coverage. Additionally, its high efficiency and advanced thermal management make it well-suited for deployments where power consumption and heat generation are key considerations.

  4. Performance Characteristics: The amplifier’s performance metrics are indicative of its capability to handle high-speed and high-frequency signals. The broad frequency range and high output power ensure compatibility with various 5G bands and effective signal transmission. The high gain and excellent linearity contribute to maintaining signal strength and quality over long distances, ensuring reliable communication within the network.

In summary, the Qualcomm QPM-5577-0-LGA62B+S-TR-02-0 is a high-performance power amplifier designed for the demanding requirements of 5G networks. Its combination of advanced features, compact design, and efficient thermal management makes it an excellent choice for modern telecommunications infrastructure, delivering reliable and high-quality signal amplification in various applications.


Specification

  • Frequency Range:

    • Operational Frequency: The amplifier operates over a broad frequency range, typically from 2.5 GHz to 4.2 GHz. This wide bandwidth supports various 5G frequency bands, making it adaptable to different network requirements and configurations.

  • Output Power:

    • Maximum Output Power: The QPM-5577-0 provides high output power, generally around 33 dBm. This output is crucial for maintaining strong signal transmission and ensuring reliable coverage across extensive areas.

  • Efficiency:

    • Power Efficiency: With a high efficiency of approximately 45%, the amplifier effectively reduces power consumption and minimizes heat generation. This efficiency is vital for cost-effective operation and extending the device’s operational lifespan.

  • Gain and Linearity:

    • Gain: The amplifier offers a gain of about 32 dB, essential for boosting weak signals to a level suitable for further processing and transmission. High gain ensures that the signal remains strong over larger distances.

    • Linearity: The QPM-5577-0 exhibits excellent linearity, reducing distortion and preserving the quality of complex signal modulations. This characteristic is crucial for delivering high-fidelity signal amplification in 5G networks.

  • Package Type:

    • LGA62B Package: The amplifier is housed in a Land Grid Array (LGA) package with 62 pins. This packaging format provides robust mechanical and electrical connections, as well as efficient thermal management, which is critical for high-power applications.


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