Product Description
The Qualcomm QPM-5579-0-LGA62B+S-SR-36-0 is a high-performance power amplifier designed to meet the rigorous demands of modern 5G networks. Its advanced features and robust specifications make it an essential component for high-speed and high-capacity telecommunications infrastructure.
Design and Construction: The QPM-5579-0-LGA62B+S-SR-36-0 is housed in an LGA62B package, which is engineered for high reliability and performance. The Land Grid Array (LGA) design ensures stable mechanical and electrical connections between the amplifier and the circuit board. This packaging format is crucial for maintaining signal integrity and reducing potential interference. The compact design of the package allows for efficient use of space on the circuit board, making it suitable for high-density environments.
Thermal Management: Thermal management is a key feature of the QPM-5579-0. The amplifier’s design incorporates advanced thermal dissipation technologies to manage the heat generated during operation effectively. The LGA62B package helps in distributing heat efficiently, preventing overheating and ensuring consistent performance. This effective thermal management is vital for maintaining the amplifier’s reliability and extending its operational lifespan, especially under high-power conditions.
Applications: The QPM-5579-0 is ideal for various 5G applications, including base stations, repeaters, and other critical network infrastructure components. Its high output power and gain make it suitable for scenarios requiring substantial signal amplification and extended coverage. Additionally, its high efficiency and advanced thermal management make it well-suited for deployments where power consumption and heat generation are significant considerations.
Performance Characteristics: The amplifier’s performance metrics demonstrate its capability to handle high-speed and high-frequency signals effectively. The wide frequency range ensures compatibility with multiple 5G bands, while the high output power and gain contribute to robust signal transmission over long distances. The excellent linearity of the QPM-5579-0 ensures that signals are amplified with minimal distortion, preserving the quality of complex modulations and enhancing overall network performance.
In summary, the Qualcomm QPM-5579-0-LGA62B+S-SR-36-0 is a high-performance power amplifier designed to excel in the demanding environment of 5G networks. Its advanced features, efficient design, and robust thermal management make it an excellent choice for modern telecommunications infrastructure, providing reliable and high-quality signal amplification across various applications.
Specification
Frequency Range:
Operational Frequency: The QPM-5579-0 operates over a wide frequency range, typically from 2.5 GHz to 4.2 GHz. This broad frequency coverage supports various 5G bands and provides flexibility for different network applications and deployments.
Output Power:
Maximum Output Power: The amplifier is capable of delivering a maximum output power of approximately 34 dBm. This high power output is essential for amplifying signals effectively over long distances, ensuring extensive network coverage and reliable communication.
Efficiency:
Power Efficiency: The QPM-5579-0 achieves high efficiency, generally around 46%. This efficiency is crucial for minimizing power consumption and heat generation, contributing to lower operational costs and improved device longevity.
Gain and Linearity:
Gain: The amplifier offers a gain of about 33 dB. This high gain is important for boosting weak signals to a stronger level, making it suitable for effective transmission over large areas.
Linearity: The QPM-5579-0 is known for its excellent linearity, which helps to minimize signal distortion and maintain signal integrity. This characteristic is vital for handling complex modulation schemes and ensuring high-quality signal amplification.
Package Type:
LGA62B Package: The amplifier is packaged in a Land Grid Array (LGA) format with 62 pins. This packaging provides reliable electrical and mechanical connections and supports effective thermal management, which is important for high-power applications.
