Product Description
The Qualcomm QPM-5579-1-LGA62B+S-HR-04-0 is designed to meet the rigorous demands of modern RF communication systems. Its LGA62B package is engineered for high-density applications, providing a compact footprint while maintaining excellent thermal and electrical performance. This design allows for efficient heat dissipation and minimal signal loss, which is essential for maintaining signal integrity and reliability.
The module is optimized for high-frequency applications, covering a frequency range that makes it versatile for various communication protocols, including those used in cellular, satellite, and Wi-Fi systems. Its high gain and low noise figure are critical for enhancing signal strength and clarity, which is crucial in environments with high levels of electromagnetic interference or when dealing with weak signals.
In practical terms, the QPM-5579-1-LGA62B+S-HR-04-0 is used in systems where high performance and reliability are required, such as in base stations, repeaters, and advanced consumer electronics. The module's robust design ensures that it can withstand harsh operating conditions, including extreme temperatures and high power levels, making it a reliable choice for demanding applications.
Overall, the QPM-5579-1-LGA62B+S-HR-04-0 represents a high-quality solution in the RF module market, offering a combination of high performance, compact design, and durability that makes it suitable for a wide range of applications.
Specification
Frequency Range: The module operates within a wide frequency range, typically covering from 5 GHz to 6 GHz, making it suitable for various communication bands.
Gain: It provides a high gain, typically in the range of 20-25 dB, which significantly boosts the signal strength and improves communication quality.
Noise Figure: The noise figure of the module is low, generally around 2-3 dB, which helps in maintaining signal quality by minimizing the amount of noise introduced into the system.
Power Handling: The module can handle high power levels, often up to 30 dBm, ensuring it can support powerful transmitters and maintain performance under high-power conditions.
Package Type: The module is housed in a compact LGA62B package, which features 62 pins for connections, designed for efficient mounting and connectivity on a PCB (Printed Circuit Board).
Temperature Range: It operates reliably over a wide temperature range, typically from -40°C to +85°C, ensuring stability and performance in various environmental conditions.
Impedance: The module generally has a 50-ohm impedance, which is standard for RF components, ensuring compatibility with most RF systems and components.
