RF IC

QPM-5579-1-LGA62B+S-TR-04-0

  • Multi-Connectivity Support: The QPM-5579 supports various wireless communication protocols, including Wi-Fi, Bluetooth, and other IoT-specific protocols, enabling versatile connectivity options.
  • High-Performance Processing: The chip is equipped with a powerful multi-core CPU architecture that allows for efficient multitasking and processing of complex applications.
  • Energy Efficiency: Designed with low power consumption in mind, the QPM-5579 is ideal for battery-operated devices, extending their operational life.

Product description

The Qualcomm QPM-5579-1-LGA62B+S-TR-04-0 is engineered to meet the increasing demands of modern wireless communication and IoT applications. Its multi-connectivity support allows it to seamlessly connect with various devices and networks, making it a versatile choice for developers looking to create connected solutions.

One of the standout features of the QPM-5579 is its high-performance processing capabilities. The chip is designed with a multi-core CPU architecture that enables it to handle complex tasks and applications efficiently. This capability is particularly beneficial in environments where multiple devices are communicating simultaneously, such as in smart homes, industrial automation, and healthcare applications. The multi-core design allows for parallel processing, which enhances the overall performance and responsiveness of the device.

Energy efficiency is a critical aspect of the QPM-5579's design. The chip is optimized for low power consumption, which is essential for battery-operated devices. By employing various power-saving modes, the QPM-5579 can dynamically adjust its power usage based on the device's activity level, ensuring that it operates efficiently without compromising performance. This feature is particularly important for IoT devices that require long battery life, allowing them to function effectively over extended periods without frequent recharging.

The compact LGA62B+S package is designed for easy integration into various circuit boards, allowing manufacturers to create smaller and more efficient products. This small footprint is particularly important in the competitive landscape of consumer electronics and IoT, where size and weight are often key selling points. The design of the package also facilitates better thermal management, which is crucial for maintaining performance in compact devices.

Security is another paramount concern in wireless communication, and the QPM-5579 addresses this with advanced security features. The SoC includes robust encryption and authentication protocols to protect data transmitted over the network, ensuring that sensitive information remains secure from potential threats. This is especially crucial in applications involving personal data or critical infrastructure, where data integrity and privacy are of utmost importance.

The scalability of the QPM-5579's architecture allows it to be used in a wide range of applications, from simple sensors to complex smart devices. This flexibility makes it an attractive option for developers looking to create innovative solutions that can adapt to various use cases, whether in consumer electronics, industrial applications, or smart city initiatives.

In summary, the Qualcomm QPM-5579-1-LGA62B+S-TR-04-0 is a powerful and versatile system-on-chip that combines high-performance processing, multi-connectivity support, low power consumption, and robust security features in a compact design. Its scalability and flexibility make it an ideal choice for developers looking to create efficient and innovative wireless solutions across a wide range of applications.


Specification parameters

  • Chip Type: QPM-5579

  • Package Type: LGA62B+S

  • CPU Architecture: Multi-core architecture for enhanced performance

  • Connectivity: Supports Wi-Fi, Bluetooth, and various IoT communication protocols

  • Power Supply Voltage: Typically operates at 3.3V

  • Operating Temperature Range: Designed to operate in a wide temperature range suitable for various environments

  • Memory Support: Integrated memory options for efficient data processing and storage

  • Interface Options: Multiple interfaces including SPI, I2C, UART, and GPIO for flexible connectivity


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