RF IC

QPM-5677-0-LGA40E+S-TR-01-0

  • Exceptional Power Efficiency: The module is engineered to maximize power efficiency, significantly extending battery life in portable devices. By optimizing power consumption while maintaining high performance, it ensures efficient operation in mobile and other battery-powered devices.
  • Compact LGA Package: It comes in a compact 40-pin LGA (Land Grid Array) package, which facilitates integration into devices with limited space. This compact design ensures a reliable and stable electrical connection while minimizing the footprint of the module on the device’s PCB (Printed Circuit Board).

Product Description

The Qualcomm QPM-5677-0-LGA40E+S-TR-01-0 is a high-performance RF front-end module designed to enhance wireless communication capabilities. Here’s a more detailed look at its design and functionality:

  • Integration and Performance: This module integrates advanced RF amplification technology into a compact form, focusing on delivering high efficiency and performance. Its design emphasizes high linearity and gain, which are crucial for ensuring clear and undistorted communication, particularly for high-speed data transfer.

  • Applications: The QPM-5677-0 is ideal for use in high-end smartphones, tablets, and other mobile devices that require efficient and reliable RF performance. Its broad frequency support and high power efficiency also make it suitable for applications in IoT devices, automotive communication systems, and other advanced wireless technologies.

  • Design and Reliability: The LGA40E+S-TR-01-0 package design ensures secure connectivity and robust performance. The module’s advanced thermal management system effectively manages heat, preventing thermal issues and ensuring stable performance over the module’s lifespan. This design aspect is crucial for maintaining reliability under various operational conditions.

  • Future-Proofing: With support for multiple frequency bands and high output power, the QPM-5677-0 is prepared for future advancements in wireless technology. Its capabilities help future-proof devices by supporting the transition to new generations of network standards, including 5G and beyond.

In summary, the Qualcomm QPM-5677-0-LGA40E+S-TR-01-0 is a high-performance RF front-end module that combines power efficiency, compact design, and advanced features. Its specifications and design make it a critical component for modern communication systems, ensuring reliable and high-quality signal performance across various applications.


Specification

  • Frequency Range: Operates typically between 1.8 GHz and 2.7 GHz, which encompasses key bands used in both 4G LTE and 5G networks. This frequency range supports various communication standards and ensures versatility across different network types.

  • Output Power: Provides high output power, generally around +30 dBm, necessary for strong and reliable signal transmission. This high power level helps maintain signal integrity over longer distances and in challenging conditions.

  • Gain: Offers substantial gain, up to 30 dB, which enhances signal strength and ensures robust performance. This gain is critical for amplifying weak signals and improving overall communication efficiency.

  • Linear Efficiency: Designed with high linear efficiency to minimize signal distortion and maximize effective power usage. This results in clearer signal transmission and reduces the impact of potential interference.

  • Package Type: The module is housed in a 40-pin LGA package, which provides a compact and durable interface for integration into various devices. This packaging ensures reliable connectivity and performance.

  • Temperature Range: Operates reliably within a temperature range of -40°C to +85°C, making it suitable for a wide range of environmental conditions. This temperature range ensures the module’s consistent performance in diverse operating environments.


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