Product description
The Qualcomm WTR-1625-0-164WLNSP-TR-00-0 is a highly integrated wireless transceiver module that combines multiple wireless connectivity technologies into a single compact package. It is designed to provide seamless and reliable wireless communication for a wide range of mobile devices and IoT applications.
The module supports a comprehensive set of wireless standards, including 2G, 3G, 4G LTE, Wi-Fi, and Bluetooth, enabling device manufacturers to integrate a wide range of wireless capabilities into their products. The advanced RF and baseband processing capabilities of the WTR-1625-0-164WLNSP-TR-00-0 ensure high-performance wireless communication, with support for features such as carrier aggregation, MIMO, and advanced interference mitigation techniques.
One of the key features of the module is its low power consumption, which is crucial for battery-powered devices. The module is optimized for power efficiency, allowing device manufacturers to extend the battery life of their products without compromising on wireless performance.
The compact 12 mm x 12 mm package size of the WTR-1625-0-164WLNSP-TR-00-0 makes it suitable for integration into a wide range of mobile devices and IoT products, providing a cost-effective and space-saving solution for wireless connectivity. The module's wide operating temperature range of -40°C to +85°C also ensures its reliability in diverse environmental conditions.
Overall, the Qualcomm WTR-1625-0-164WLNSP-TR-00-0 is a highly versatile and feature-rich wireless transceiver module that offers a comprehensive solution for integrating advanced wireless connectivity into mobile devices and IoT applications.
Specification parameters
Supported wireless standards: 2G (GSM/GPRS/EDGE), 3G (WCDMA/HSPA+), 4G LTE, Wi-Fi (802.11a/b/g/n/ac), Bluetooth (4.2/5.0)
Frequency bands: Supports multiple frequency bands for global coverage
Transmit power: Up to 23 dBm for cellular, up to 20 dBm for Wi-Fi
Receiver sensitivity: Typically -101 dBm for cellular, -96 dBm for Wi-Fi
Interface: MIPI, SDIO, UART, I2C, SPI
Package size: 12 mm x 12 mm
Operating temperature range: -40°C to +85°C
Power consumption: Optimized for low power operation