Product Description
The Qualcomm WTR-3905-0-106BWLPSP-03-0 is a high-performance wireless transceiver that supports various frequency bands, including LTE FDD, LTE TDD, WCDMA, and GSM. It integrates a transceiver, synthesizer, and power management circuits, reducing the need for external components and simplifying the design process.
The WTR-3905 supports high data rates, enabling fast download and upload speeds for applications such as video streaming and online gaming. It also supports advanced features such as carrier aggregation, MIMO, and beamforming, enhancing network performance and coverage.
The component has one receive chain and one transmit chain, providing basic network connectivity. It can deliver a maximum output power of +23 dBm (LTE FDD), +20 dBm (LTE TDD), +23 dBm (WCDMA), and +33 dBm (GSM), ensuring reliable connectivity in various network environments.
The WTR-3905 has a typical current consumption of 250 mA (LTE FDD), 300 mA (LTE TDD), 250 mA (WCDMA), and 250 mA (GSM), providing power efficiency and extending battery life in mobile devices. It is available in a 5x5 mm, 48-pin Flip-Chip BGA package, making it suitable for compact mobile devices.
Overall, the Qualcomm WTR-3905-0-106BWLPSP-03-0 is a high-performance wireless transceiver that provides basic network connectivity, reliability, and power efficiency in mobile devices. While it has fewer receive and transmit chains compared to the WTR-3900 series, it still offers high data rates and advanced features, making it an ideal solution for mobile devices
Specification
Frequency Bands: LTE FDD (B1-B5, B7-B20, B25, B26, B29, B30), LTE TDD (B38, B39, B40, B41), WCDMA (B1-B8), GSM (850/900/1800/1900 MHz)
Transceiver Type: Direct-conversion
Number of Receive Chains: 1
Number of Transmit Chains: 1
Maximum Output Power: +23 dBm (LTE FDD), +20 dBm (LTE TDD), +23 dBm (WCDMA), +33 dBm (GSM)
Maximum Data Rate: 150 Mbps (LTE FDD), 112 Mbps (LTE TDD), 42 Mbps (WCDMA), 5.76 Mbps (GSM)
Power Consumption: Typical current consumption of 250 mA (LTE FDD), 300 mA (LTE TDD), 250 mA (WCDMA), 250 mA (GSM)
Package: 5x5 mm, 48-pin Flip-Chip BGA
