System on Chip (SoC)

SXR-1120-0-771PSP-TR-01-0-AB

  • High-Precision Performance: The Qualcomm SXR-1120-0-771PSP-TR-01-0-AB is engineered for high-precision RF applications. It provides exceptional performance in terms of signal clarity, accuracy, and minimal distortion, making it ideal for advanced communication systems.
  • Compact Design: This component features a compact design that allows for efficient use of space in dense circuit layouts. Its small size makes it suitable for integration into systems where space is at a premium.

Product description

The Qualcomm SXR-1120-0-771PSP-TR-01-0-AB is a sophisticated RF component designed for high-precision applications. It is encapsulated in a specialized package that is optimized for performance and integration in complex systems.


RF Performance: The SXR-1120-0-771PSP-TR-01-0-AB offers exceptional RF performance, characterized by high precision and low noise. It is engineered to handle signals with minimal distortion, making it suitable for high-frequency applications such as advanced communication systems, radar, and electronic warfare.


Compact and Efficient Design: The component's compact design facilitates its use in space-constrained environments. Its small footprint allows for efficient use of PCB real estate, making it ideal for integration into high-density circuit designs without sacrificing performance.


Thermal Management: Effective thermal management is a key feature of the SXR-1120-0-771PSP-TR-01-0-AB. The component is designed to operate within a wide temperature range, ensuring reliability and consistent performance even under varying thermal conditions. This is achieved through a well-engineered package that aids in heat dissipation.


Versatility and Reliability: The SXR-1120-0-771PSP-TR-01-0-AB is versatile and can be used in a range of high-performance RF applications. Its advanced integration minimizes the need for additional components, streamlining the design process and enhancing overall system reliability.


For comprehensive information on the SXR-1120-0-771PSP-TR-01-0-AB, including detailed electrical characteristics and application guidelines, the component’s datasheet should be consulted. The datasheet provides essential details on the component's specifications, performance, and operational requirements.


Specification parameters

  • Package Type: The SXR-1120-0-771PSP-TR-01-0-AB is housed in a specialized package designed for its specific application needs. Details regarding the package dimensions and type are typically provided in the datasheet, ensuring compatibility with various PCB designs.

  • Operating Frequency Range: The component is designed to operate within a defined frequency range optimized for its intended RF applications. The exact frequency specifications and bandwidth are detailed in the datasheet.

  • Voltage and Power Requirements: The SXR-1120-0-771PSP-TR-01-0-AB operates within specific voltage and power limits. Accurate voltage and power requirements are crucial for ensuring the component functions correctly and reliably. These details are specified in the datasheet.

  • Thermal Range: The component is built to function across a broad temperature range, ensuring stable performance in varying environmental conditions. The thermal specifications, including maximum operating temperature, are outlined in the datasheet.

  • Impedance and Matching: The SXR-1120-0-771PSP-TR-01-0-AB is designed with impedance matching features to minimize signal reflections and losses. Proper impedance matching is critical for maintaining signal integrity and overall system performance.


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