Product description
The Qualcomm SXR-2130P-0-MPSP1099-MT-02-0-AA is a high-performance RF component designed to meet the rigorous demands of high-power RF applications. It is housed in a compact metal package that combines efficiency with durability.
RF Performance: The SXR-2130P-0-MPSP1099-MT-02-0-AA is engineered for high power handling, which is crucial for applications requiring substantial RF output. It offers high efficiency, low distortion, and excellent signal clarity, making it suitable for advanced communication systems, broadcasting, and other high-power RF uses.
Thermal Management: The metal package design is optimized for effective thermal dissipation. This is essential for high-power applications where managing heat is critical to prevent performance degradation and component failure. The package helps maintain thermal stability, ensuring reliable operation even under high power conditions.
Compact and Robust Design: The compact MT package allows the SXR-2130P-0-MPSP1099-MT-02-0-AA to be used in space-constrained environments without compromising performance. Its robust construction ensures durability and resistance to mechanical stress, which is important for maintaining long-term reliability.
Integration and Versatility: With its advanced RF integration, the SXR-2130P-0-MPSP1099-MT-02-0-AA reduces the need for additional external components, simplifying system design and improving overall reliability. It is versatile enough to be used in various high-power RF applications, from communication infrastructure to broadcast systems.
For detailed electrical characteristics, operational parameters, and specific application recommendations, the component’s datasheet should be consulted. This document provides comprehensive information on the SXR-2130P-0-MPSP1099-MT-02-0-AA, including its specifications and performance metrics.
Specification parameters
Package Type: MT - The SXR-2130P-0-MPSP1099-MT-02-0-AA is enclosed in a metal package (MT) that provides effective heat dissipation and mechanical protection. The package design is optimized for high-power applications and is compact enough to fit into space-constrained designs.
Operating Frequency Range: The component operates within a specified frequency range optimized for RF applications. The exact frequency range and bandwidth details are provided in the datasheet, ensuring that it meets the requirements for various high-frequency applications.
Voltage and Power Requirements: The SXR-2130P-0-MPSP1099-MT-02-0-AA has defined voltage and power specifications that must be adhered to for proper operation. Detailed voltage and power requirements are listed in the datasheet, and it is essential to operate the component within these limits to ensure optimal performance.
Thermal Specifications: The component is designed to operate over a wide temperature range. The thermal management capabilities are crucial for maintaining performance under different environmental conditions. The maximum operating temperature and other thermal specifications are detailed in the datasheet.
Impedance and Matching: The SXR-2130P-0-MPSP1099-MT-02-0-AA includes features for impedance matching, which are critical for reducing signal reflections and ensuring efficient power transfer. Proper impedance matching is essential for maintaining signal integrity and minimizing losses.
