Product description
The Qualcomm SXR-2130P-1-MPSP1017-TR-02-0-AA is an RF power amplifier module tailored for high-demand applications such as telecommunications, broadcasting, and advanced electronic systems.
Design and Build: The module features a rugged build quality with a compact design that ensures durability and ease of integration. It typically includes advanced materials and technology to enhance performance and reliability.
Performance Characteristics: It provides a high level of performance with low noise and distortion, which is crucial for maintaining signal clarity and quality in complex communication environments.
Application Areas: This module is well-suited for use in base stations, communication equipment, and other RF systems where high power and efficiency are required. Its ability to operate across a wide frequency range makes it versatile for various applications.
Integration: The module is designed for easy integration into existing systems. Its compact size and standard packaging options facilitate seamless incorporation into various electronic designs.
Reliability and Longevity: With robust thermal management and high-quality components, the SXR-2130P-1-MPSP1017-TR-02-0-AA is built to offer long-term reliability and consistent performance, making it a dependable choice for critical communication systems.
For precise details such as exact frequency ranges, output power levels, and specific operational parameters, it is recommended to consult the official datasheet or technical documentation provided by Qualcomm or the module's distributor.
Specification parameters
The Qualcomm SXR-2130P-1-MPSP1017-TR-02-0-AA comes with the following technical specifications:
Frequency Range: The module operates effectively within a specified frequency range that caters to different communication needs. (Note: Exact frequency range details should be referenced from the specific datasheet for accuracy.)
Output Power: The module can deliver substantial output power, which is essential for achieving desired signal strength and coverage in communication systems.
Gain: It features high gain characteristics, which improves signal amplification and enhances overall system performance.
Power Supply Voltage: The module operates within a defined voltage range, ensuring compatibility with various power sources and system designs.
Package Type: It typically comes in a standard package type suitable for surface-mount or through-hole assembly, facilitating easy integration into electronic systems.
Thermal Management: Designed with efficient thermal management to handle heat dissipation effectively, ensuring stable operation and longevity of the module.
