Product description
The Qualcomm QPA-4360-1-54LGA-TR-0B-1 is an advanced RF power amplifier designed to deliver high performance in modern communication systems. Here’s a comprehensive look at its design, functionality, and potential applications:
Design and Materials: The QPA-4360-1-54LGA-TR-0B-1 is built using cutting-edge semiconductor materials and manufacturing processes. These design choices ensure the amplifier operates efficiently over a broad frequency range and provides robust performance. The materials and fabrication techniques used contribute to its low noise figure and high linearity, which are essential for maintaining signal integrity and achieving reliable amplification.
Operational Characteristics: With a frequency range of 1.8 GHz to 2.2 GHz, the QPA-4360-1-54LGA-TR-0B-1 is highly versatile, supporting various communication technologies including 4G LTE and future 5G systems. The amplifier delivers a high gain of approximately 29 dB and can output up to 31 dBm (1.25 watts) of power. This combination ensures effective amplification of weak signals, enhancing the performance of communication networks.
Thermal Management: The amplifier features advanced thermal management capabilities with a thermal resistance of about 18°C/W. This ensures effective heat dissipation, which is critical for maintaining stable performance and preventing overheating during high-power operation. Effective thermal management is key to extending the amplifier’s lifespan and ensuring reliable operation.
Integration and Packaging: The 54-pin LGA package provides a compact and efficient solution for integrating the amplifier into electronic systems. This packaging format allows for high-density integration, which is ideal for space-constrained designs. The LGA package also ensures reliable electrical connections, which is essential for maintaining consistent performance and reducing the risk of connection issues.
Applications: The QPA-4360-1-54LGA-TR-0B-1 is well-suited for high-frequency communication applications such as cellular infrastructure, advanced wireless communication systems, and other high-power transmission technologies. Its high output power, low noise figure, and broad frequency range make it suitable for scenarios where robust signal strength and superior signal clarity are required.
Reliability and Durability: Designed to operate reliably in various environmental conditions, the QPA-4360-1-54LGA-TR-0B-1 offers durability and consistent performance over time. Its robust construction ensures that it can withstand high-stress conditions and maintain functionality in challenging environments.
In summary, the Qualcomm QPA-4360-1-54LGA-TR-0B-1 is a high-performance RF power amplifier that combines advanced features with reliable operation. Its broad frequency range, high gain, and effective thermal management make it a valuable component for modern communication systems that demand powerful amplification and superior signal clarity.
Specification parameters
Frequency Range: The amplifier operates within a frequency range of 1.8 GHz to 2.2 GHz, making it suitable for a range of high-frequency communication technologies.
Gain: It provides a high gain of approximately 29 dB. This level of gain is crucial for amplifying weak input signals to a stronger output, thereby enhancing the performance of communication systems.
Output Power: The QPA-4360-1-54LGA-TR-0B-1 can deliver up to 31 dBm (1.25 watts) of output power. This significant power output is suitable for applications requiring robust signal strength and extended coverage.
Noise Figure: The amplifier features a low noise figure of about 1.6 dB. This ensures that the amplifier adds minimal noise to the signal, preserving the quality and integrity of the transmitted data.
Power Supply Voltage: It operates with a power supply voltage ranging from 5V to 12V. This flexibility allows for various power management configurations and adaptability to different system designs.
Thermal Resistance: The amplifier has a thermal resistance of approximately 18°C/W, indicating effective heat dissipation capabilities. This helps in maintaining stable performance and extending the device’s operational lifespan.
Package Type: The QPA-4360-1-54LGA-TR-0B-1 is housed in a 54-pin LGA (Land Grid Array) package. This packaging format provides a compact and efficient solution for integration into electronic systems while supporting reliable electrical connections.
