Product description
The Qualcomm QPA-4361-0-54LGA-TR-03-0 is a cutting-edge RF power amplifier designed to deliver superior performance for modern communication systems. Here’s an in-depth look at its design, functionality, and potential applications:
Design and Materials: The QPA-4361-0-54LGA-TR-03-0 is built using advanced semiconductor materials and precision manufacturing techniques. These choices ensure the amplifier operates efficiently over a broad frequency range and delivers reliable performance. The design emphasizes low noise and high linearity, essential for maintaining signal integrity and achieving high-quality amplification.
Operational Characteristics: With a frequency range of 1.8 GHz to 2.2 GHz, the QPA-4361-0-54LGA-TR-03-0 supports various communication technologies, including 4G LTE and future 5G systems. It provides a high gain of approximately 30 dB and can deliver up to 32 dBm (1.6 watts) of output power. This combination allows for effective amplification of weak signals, enhancing the overall performance and reliability of communication networks.
Thermal Management: The amplifier features advanced thermal management with a thermal resistance of about 17°C/W. This capability ensures efficient heat dissipation, which is critical for maintaining stable performance and preventing overheating during high-power operation. Effective thermal management is crucial for extending the amplifier’s lifespan and ensuring long-term reliability.
Integration and Packaging: The 54-pin LGA package provides a compact and efficient solution for integrating the amplifier into electronic systems. This packaging format allows for high-density integration, which is ideal for space-constrained designs. The LGA package also ensures reliable electrical connections, supporting consistent performance and reducing the risk of connection issues.
Applications: The QPA-4361-0-54LGA-TR-03-0 is well-suited for high-frequency communication applications such as cellular infrastructure, advanced wireless communication systems, and other high-power transmission technologies. Its high output power, low noise figure, and broad frequency range make it suitable for scenarios requiring robust signal strength and superior signal clarity.
Reliability and Durability: Designed for reliable operation in various environmental conditions, the QPA-4361-0-54LGA-TR-03-0 offers durability and consistent performance over time. Its robust construction ensures it can withstand high-stress conditions and maintain functionality in challenging environments.
In summary, the Qualcomm QPA-4361-0-54LGA-TR-03-0 is a high-performance RF power amplifier that combines advanced features with dependable operation. Its wide frequency range, high gain, and effective thermal management make it a valuable component for modern communication systems that demand powerful amplification and superior signal quality.
Specification parameters
Frequency Range: The amplifier operates within a frequency range of 1.8 GHz to 2.2 GHz, making it suitable for various high-frequency communication technologies.
Gain: It provides a high gain of approximately 30 dB. This high gain level is crucial for amplifying weak input signals to a stronger output level, thus enhancing the overall performance of communication systems.
Output Power: The QPA-4361-0-54LGA-TR-03-0 can deliver up to 32 dBm (1.6 watts) of output power. This substantial power output is ideal for applications that require robust signal strength and extended range.
Noise Figure: The amplifier features a low noise figure of about 1.7 dB. This low noise figure ensures that the amplifier adds minimal noise to the signal, preserving the quality and clarity of the transmitted data.
Power Supply Voltage: It operates with a power supply voltage in the range of 5V to 12V. This flexibility allows for various power management configurations and adaptability to different system designs.
Thermal Resistance: The amplifier has a thermal resistance of approximately 17°C/W, indicating effective heat dissipation capabilities. This helps in maintaining stable performance and extending the device’s operational lifespan.
Package Type: The QPA-4361-0-54LGA-TR-03-0 is housed in a 54-pin LGA package. This packaging format supports high-density integration and reliable electrical connections while minimizing the PCB footprint.
