Power Amplifier

QPA-5581-0-LGA36D+S-HR-00-1

  • Compact LGA Package: The QPA-5581 is housed in a compact Land Grid Array (LGA) package, which is advantageous for space-constrained applications. The small footprint facilitates easy integration into mobile devices and other compact electronic systems, allowing manufacturers to design sleeker products without compromising performance. The LGA package also enhances thermal performance and reliability.
  • Integrated Features for Enhanced Performance: The amplifier includes integrated features such as automatic power control and temperature compensation. These features enhance the overall performance of the device by ensuring optimal operation under varying conditions, simplifying the design process for engineers, and improving overall system efficiency.

产品描述

The Qualcomm QPA-5581-0-LGA36D+S-HR-00-1 is a cutting-edge power amplifier tailored for high-performance applications in the telecommunications sector, particularly in the context of 5G technology. Its design emphasizes high efficiency, wide frequency range, and compact form factor, making it an ideal choice for modern mobile devices and infrastructure.

One of the standout features of the QPA-5581 is its ability to deliver high output power while maintaining excellent efficiency. This is particularly important in the context of 5G networks, where devices must handle increased data rates and support a larger number of simultaneous connections. The amplifier's high efficiency helps to minimize power consumption, which is critical for battery-operated devices, ensuring longer usage times between charges.

The wide frequency range of the QPA-5581 allows it to support various communication protocols, making it a versatile choice for manufacturers looking to develop devices that can operate on multiple networks. This flexibility is essential in today’s rapidly evolving telecommunications landscape, where devices must be capable of adapting to different standards and frequencies.

In terms of integration, the QPA-5581's compact LGA package allows for efficient use of space on circuit boards, which is crucial for modern mobile devices that prioritize slim designs. The integrated power control features further enhance usability by allowing the amplifier to adjust its output dynamically based on the operating conditions, thereby optimizing performance and reducing power consumption.

Thermal management is another critical aspect of the QPA-5581's design. The amplifier is built to handle heat effectively, ensuring that it can operate reliably in various environmental conditions without the risk of overheating. This robustness is vital for maintaining consistent performance over time, especially in outdoor applications where temperature fluctuations can be significant.

In summary, the Qualcomm QPA-5581-0-LGA36D+S-HR-00-1 is a state-of-the-art power amplifier that combines high efficiency, a wide frequency range, and a compact design. Its specifications and features make it an excellent choice for manufacturers in the telecommunications industry, providing the performance needed for next-generation wireless communication systems while ensuring energy efficiency and reliability.


规格参数

  1. Operating Frequency: The QPA-5581 operates within a frequency range of 3.0 GHz to 5.0 GHz, making it suitable for various wireless communication standards, including sub-6 GHz 5G, LTE, and Wi-Fi.

  2. Output Power: The amplifier can deliver a maximum output power of up to 30 dBm, providing sufficient power for effective signal transmission in mobile networks.

  3. Power Gain: The device offers a power gain of approximately 30 dB, which is essential for amplifying weak signals to a level suitable for transmission.

  4. Efficiency: The typical efficiency of the QPA-5581 is around 40% at maximum output power, which is competitive for power amplifiers in its class, ensuring minimal energy waste.

  5. Supply Voltage: The amplifier operates with a supply voltage of 5V, which is standard for many RF applications, ensuring compatibility with existing designs.

  6. Thermal Resistance: The thermal resistance of the device is designed to manage heat effectively, allowing for stable operation without overheating.


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